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TPS71256DRCR

Texas Instruments

TPS71256DRCR by Texas Instruments

TPS71256DRCR by Texas Instruments is a PMOS technology-based LDO regulator with 2 outputs. It has a max dropout voltage of 0.23 V, operating temperature range from -40 to 125°C, and can handle up to 0.25 A output current per channel. Ideal for applications requiring stable power supply in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,496 parts In-Stock

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4,496

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Digiode

USA . 4,313 parts In-Stock

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4,313

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Distributors (Availability)

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Parana Technologies

USA . 701 parts In-Stock

1+ parts

$3.239

100+ parts

-

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$3.759

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701

$3.239

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$3.759

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DigiPath Technology Company

USA . 2,186 parts In-Stock

1+ parts

$3.566

100+ parts

$3.281

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2,186

$3.566

$3.281

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ChromeModa Solutions

Germany . 2,196 parts In-Stock

1+ parts

$3.639

100+ parts

$2.984

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2,196

$3.639

$2.984

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IDEA Electronic Components Group

UK . 302 parts In-Stock

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$3.639

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$3.275

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302

$3.639

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$3.275

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Semicontronic

India . 1,361 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

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1,361

$5.500

$5.362

$5.335

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AZTECH Wire

Italy . 348 parts In-Stock

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$18.589

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348

$18.589

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One Stop Electronics

USA . 1,288 parts In-Stock

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$21.500

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1,288

$21.500

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Ampacity Inc.

Singapore . 1,173 parts In-Stock

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$22.500

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1,173

$22.500

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QUARKTWIN TECHNOLOGY LTD

USA . 6,547 parts In-Stock

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Microchip USA

USA . 3,955 parts In-Stock

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Corphita

USA . 1,629 parts In-Stock

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Corohmni

South Africa . 172 parts In-Stock

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Overview

Elevate your electronics with the TPS71256DRCR by Texas Instruments, a top-tier producer of cutting-edge technology. As a fixed positive multiple output LDO regulator, this product offers unparalleled quality and reliability. With its compact design and advanced features, the TPS71256DRCR is ideal for a wide range of applications. Experience the value of seamless power management and superior performance with Texas Instruments' innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and reliability for the regulator.

Maximum Dropout Voltage-1: 2.23 V

The low maximum dropout voltage of 2.23 V ensures efficient regulation and minimal power loss in the circuit.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Operating Temperature (TJ-Max): 125 °C

The high operating temperature of 125°C ensures stable performance in various environments.

Nominal Output Voltage-2: 2.8 V

The nominal output voltage of 2.8 V provides a stable output for the connected devices.

Operating Temperature (TJ-Min): -40 °C

The low operating temperature of -40°C ensures reliable operation even in extreme cold conditions.

Technology: PMOS

The PMOS technology offers high efficiency and low power consumption, making it an energy-efficient choice.

Minimum Input Voltage: 3.03 V

The minimum input voltage of 3.03 V ensures compatibility with a wide range of power sources.

Technical Specifications

Fixed Regulators - Positive Multiple Output LDO TPS71256DRCR attributes and parameters. Explore more Fixed Regulators - Positive Multiple Output LDO devices from Texas Instruments

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.23 V

Nominal Dropout Voltage-1:

.125 V

Maximum Dropout Voltage-2:

.23 V

Maximum Input Voltage Absolute:

6 V

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.03 V

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Functions:

1

No. of Outputs:

2

No. of Terminals:

10

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.25 A

Maximum Output Current-2:

.25 A

Maximum Output Voltage-1:

2.884 V

Minimum Output Voltage-1:

2.716 V

Nominal Output Voltage-1:

2.8 V

Maximum Output Voltage-2:

2.884 V

Minimum Output Voltage-2:

2.716 V

Nominal Output Voltage-2:

2.8 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification Status:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

PMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

3 mm

Trade Compliance

TPS71256DRCR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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