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TPS65130RGERG4

Texas Instruments

TPS65130RGERG4 by Texas Instruments

TPS65130RGERG4 by Texas Instruments is a switching regulator with 24 terminals, operating temperature range of -40 to 85°C, and output voltage ranging from 3.2V to 15V. It is ideal for industrial applications requiring a boost switcher configuration with a max output current of 0.9A at a frequency of up to 1500kHz.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 32,070 parts In-Stock

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Vyrian

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Digiode

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Nova Conductors

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Ampacity Inc.

Singapore . 144 parts In-Stock

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$2.500

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One Stop Electronics

USA . 946 parts In-Stock

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$5.500

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Semicontronic

India . 126 parts In-Stock

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$5.500

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$5.362

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$5.335

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AZTECH Wire

Italy . 848 parts In-Stock

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$11.937

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Corohmni

South Africa . 225 parts In-Stock

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$14.753

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Parana Technologies

USA . 1,583 parts In-Stock

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$19.492

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$19.498

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DigiPath Technology Company

USA . 406 parts In-Stock

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$21.463

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$19.746

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ChromeModa Solutions

Germany . 3,283 parts In-Stock

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$21.901

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IDEA Electronic Components Group

UK . 1,744 parts In-Stock

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Component Stockers USA

USA . 458 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Elevate your electronics with the TPS65130RGERG4 from Texas Instruments, a cutting-edge switching regulator that delivers unparalleled performance and reliability. With a reputation for excellence, Texas Instruments ensures that every product meets the highest quality standards. Ideal for a wide range of applications, this chip carrier offers superior power management capabilities while maintaining a very thin profile. Boost your devices with the TPS65130RGERG4 and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly, saving time and cost during production.

Package Shape: SQUARE

Square package shape facilitates easier placement on circuit boards, optimizing space usage.

No. of Terminals: 24

With 24 terminals, the product offers versatile connectivity options for different circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures product reliability and stability in various operating conditions.

Minimum Output Voltage: 3.2 V

Low minimum output voltage allows for efficient power conversion for a wide range of applications.

Control Mode: CURRENT-MODE

Current-mode control provides accurate and adjustable output voltage regulation, enhancing overall performance.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature ensures product functionality in extreme temperature environments.

Maximum Output Voltage: 15 V

High maximum output voltage capability supports a broad range of applications requiring different voltage levels.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term product reliability.

Terminal Position: QUAD

Quad terminal position allows for easy integration into quad-pin configurations, enhancing product versatility.

Width (mm): 4 mm

Compact width dimension facilitates efficient board space utilization and integration in tight layouts.

Other IC type: SWITCHING REGULATOR

Switching regulator design ensures high efficiency power conversion, reducing heat dissipation and enhancing energy savings.

Nominal Input Voltage: 3.6 V

Nominal input voltage of 3.6 V suits a wide range of applications requiring different voltage levels for operation.

Maximum Switching Frequency: 1500 kHz

High maximum switching frequency allows for fast response and control, ensuring optimal performance in dynamic load conditions.

Maximum Output Current: 0.9 A

Maximum output current of 0.9 A provides sufficient power for various applications while maintaining stable performance.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique offers precise and efficient regulation of output voltage, improving overall efficiency.

Switcher Config: BOOST

Boost switcher configuration efficiently increases output voltage levels above the input voltage, making it suitable for specific applications.

Minimum Input Voltage: 2.7 V

Low minimum input voltage allows the product to operate in low-power scenarios efficiently, enhancing its versatility.

Maximum Input Voltage: 5.5 V

High maximum input voltage capability supports a wide range of input power sources, making the product adaptable to different systems.

Technical Specifications

Switching Regulators & Controllers TPS65130RGERG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.7 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

Maximum Negative Input Voltage:

-2 V

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.9 A

Maximum Output Voltage:

15 V

Minimum Output Voltage:

3.2 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

1500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

4 mm

Trade Compliance

TPS65130RGERG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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