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TPS65051EVM-195

Texas Instruments

TPS65051EVM-195 by Texas Instruments

TPS65051EVM-195 by Texas Instruments is a DC/DC & AC/DC SMPS Evaluation Board with 6 non-isolated outputs (1.2V, 1.6V, 3.3V). It operates at an input voltage of 2.5V to 6V, uses Buck regulator topology at a switching frequency of 2.25MHz, and is ideal for DC/DC step-down applications requiring multiple output voltages in the range of 200mA to 1A.

Median Price

$49.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Texas Instruments

USA . 10 parts In-Stock

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$49.000

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Digiode

USA . 3,068 parts In-Stock

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$46.550

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Vyrian

USA . 8,845 parts In-Stock

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AZTECH Wire

Italy . 1,077 parts In-Stock

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$19.670

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Semicontronic

India . 6 parts In-Stock

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$41.650

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$40.609

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$40.400

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Corphita

USA . 4,449 parts In-Stock

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$44.100

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Corohmni

South Africa . 229 parts In-Stock

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$90.650

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ChromeModa Solutions

Germany . 4,432 parts In-Stock

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DigiPath Technology Company

USA . 1,469 parts In-Stock

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IDEA Electronic Components Group

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Parana Technologies

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Perfect Parts

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Overview

Discover the exceptional quality and reliability of the TPS65051EVM-195 by Texas Instruments, a leading manufacturer in the industry. This versatile development board offers a wide range of applications in DC/DC, step down with LDO, making it ideal for various projects. With 6 non-isolated outputs and a regulator topology of Buck, this evaluation board delivers consistent performance and efficiency. Experience the value and benefits of using the TPS65051EVM-195 for your next project, providing you with the advantage of high-quality results and reliable operation.

Feature Benefit Bullets

Other Names: 296-31271

This product can be easily identified and searched for using multiple names, making it convenient for procurement.

Category: Development Boards, Kits, Programmers

This product falls under a category suitable for engineers and developers looking to evaluate and test DC/DC SMPS designs.

Outputs and Type: 6, Non-Isolated

With six non-isolated outputs, this product provides versatility in powering multiple components in a circuit without isolation requirements.

Voltage - Output: 1.2V, 1.2V, 1.6V, 3.3V, 3.3V, 3.3V

The range of output voltages offered by this product caters to various components with different voltage requirements in a circuit.

Current - Output: 1A, 600mA, 400mA, 400mA, 200mA, 200mA

The varying output currents allow for powering components with different current consumption without the need for external current regulation.

Voltage - Input: 2.5V ~ 6V

The wide input voltage range provides flexibility in power sourcing, accommodating diverse power supplies in different applications.

Frequency - Switching: 2.25MHz

The high switching frequency ensures efficient power conversion and regulation, contributing to better overall performance.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL rating of 1 (Unlimited) indicates that this product is not sensitive to moisture, making it suitable for a wide range of operating environments.

Technical Specifications

Additional Parts TPS65051EVM-195 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down with LDO

Other Names:

296-31271
TPS65051EVM195
TPS65051EVM-195-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

1A, 600mA, 400mA, 400mA, 200mA, 200mA

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

2.25MHz

Supplied Contents:

Board(s)

Voltage - Output:

1.2V, 1.2V, 1.6V, 3.3V, 3.3V, 3.3V

Board Type:

Fully Populated

Outputs and Type:

6, Non-Isolated

Utilized IC / Part:

TPS65051

Package:

Box

Voltage - Input:

2.5V ~ 6V

Base Product Number:

TPS65051

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS65051EVM-195 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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