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TPS65030EVM-162

Texas Instruments

TPS65030EVM-162 by Texas Instruments

TPS65030EVM-162 by Texas Instruments is a DC/DC evaluation board with 4 non-isolated outputs (1.5V, 1.8V, 3.3V, 5V) and input voltage range of 3-5.25V. It features Buck regulator topology, switching frequency of 1MHz, and is designed for DC/DC step-down applications utilizing TPS65030 IC.

Median Price

$51.740

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

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$51.740

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$51.740

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Distributors (In-Stock)

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Digiode

USA . 1,360 parts In-Stock

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$49.153

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$49.153

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Vyrian

USA . 8,049 parts In-Stock

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8,049

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Distributors (Availability)

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Semicontronic

India . 2 parts In-Stock

1+ parts

$45.810

100+ parts

$44.665

1k+ parts

$44.436

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2

$45.810

$44.665

$44.436

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Corphita

USA . 2,602 parts In-Stock

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$46.566

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$46.566

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Corohmni

South Africa . 86 parts In-Stock

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$51.740

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86

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$99.720

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$99.720

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ChromeModa Solutions

Germany . 2,486 parts In-Stock

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Parana Technologies

USA . 2,044 parts In-Stock

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$0.293

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2,044

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DigiPath Technology Company

USA . 1,586 parts In-Stock

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1,586

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IDEA Electronic Components Group

UK . 1,254 parts In-Stock

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Perfect Parts

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Overview

Upgrade your power management system with the TPS65030EVM-162 from Texas Instruments. Designed to deliver high-quality, efficient power conversion solutions, this development board is perfect for a wide range of applications. Whether you need to step down voltage, regulate output, or optimize energy efficiency, the TPS65030EVM-162 has you covered. With its reliable performance and easy integration, this evaluation board offers immense value and convenience to customers looking to enhance their power supply designs. Trust Texas Instruments for cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Main Purpose: DC/DC, Step Down with LDO

This product is versatile and can be used for both DC/DC conversion and providing low-dropout voltage regulation, making it suitable for a variety of applications.

Voltage - Output: 1.5V, 1.8V, 3.3V, 5V

The wide range of output voltage options allows for flexibility in design and compatibility with different components.

Current - Output: 200mA, 100mA, 60mA, 22mA

The product can handle various output currents, catering to different power requirements in the system.

Voltage - Input: 3V ~ 5.25V

The input voltage range is common in many electronic systems, enabling easy integration of this product into existing setups.

Frequency - Switching: 1MHz

The high switching frequency allows for efficient power conversion and helps in reducing the size of external components.

Technical Specifications

Additional Parts TPS65030EVM-162 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down with LDO

Other Names:

TPS65030EVM162
296-31427
TPS65030EVM-162-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

200mA, 100mA, 60mA, 22mA

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

1MHz

Supplied Contents:

Board(s)

Voltage - Output:

1.5V, 1.8V, 3.3V, 5V

Board Type:

Fully Populated

Outputs and Type:

4, Non-Isolated

Utilized IC / Part:

TPS65030

Package:

Bulk

Voltage - Input:

3V ~ 5.25V

Base Product Number:

TPS650

Moisture Sensitivity Level (MSL):

Not Applicable

Trade Compliance

TPS65030EVM-162 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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