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TPS65023EVM-205

Texas Instruments

TPS65023EVM-205 by Texas Instruments

TPS65023EVM-205 by Texas Instruments is a DC/DC & AC/DC SMPS Evaluation Board with 6 non-isolated outputs (1.1V to 3.3V). It operates at an input voltage of 3V to 5.5V, uses Buck regulator topology, and has a switching frequency of 2.25MHz. This board is designed for evaluating the TPS65023 IC in applications requiring DC/DC step-down with LDO functionality.

Median Price

$53.905

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 15 parts In-Stock

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$49.000

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Mouser Electronics

USA . 1 parts In-Stock

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$58.810

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Digiode

USA . 1,974 parts In-Stock

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$46.550

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Vyrian

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Corphita

USA . 3,275 parts In-Stock

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Corohmni

South Africa . 130 parts In-Stock

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Ampacity Inc.

Singapore . 6 parts In-Stock

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$90.650

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Semicontronic

India . 6 parts In-Stock

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$90.650

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$88.384

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$87.930

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IDEA Electronic Components Group

UK . 2,178 parts In-Stock

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DigiPath Technology Company

USA . 1,114 parts In-Stock

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Parana Technologies

USA . 876 parts In-Stock

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ChromeModa Solutions

Germany . 255 parts In-Stock

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Overview

Discover the innovative TPS65023EVM-205 by Texas Instruments, a high-quality evaluation board designed for DC/DC step-down applications. With 6 non-isolated outputs ranging from 1.1V to 3.3V, this development board is perfect for a variety of projects. Texas Instruments, known for their reliable and cutting-edge products, delivers exceptional value with the TPS65023EVM-205. Explore new possibilities and unlock the full potential of your designs with this versatile and efficient solution.

Feature Benefit Bullets

Other Names: 296-31267, TPS65023EVM-205-ND, TPS65023EVM205

Multiple names make it easy to search and identify the product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Versatile category allows for different applications and testing purposes.

Main Purpose: DC/DC, Step Down with LDO

Suitable for applications requiring step-down voltage regulation with low-dropout characteristics.

Outputs and Type: 6, Non-Isolated

Multiple non-isolated output options provide flexibility in design and power distribution.

Voltage - Output: 1.1V, 1.3V, 1.55V, 2.5V, 3V, 3.3V

Offers a wide range of output voltages to accommodate various system requirements.

Current - Output: 1.5A, 1.2A, 800mA, 200mA, 200mA, 20mA

Capable of providing different output currents for diverse load demands.

Voltage - Input: 3V ~ 5.5V

Accepts a wide input voltage range for compatibility with different power sources.

Regulator Topology: Buck

Buck regulator topology offers efficient voltage conversion for improved power management.

Frequency - Switching: 2.25MHz

High switching frequency enables compact design and efficient operation.

Board Type: Fully Populated

Ready-to-use board saves time and effort in setting up for evaluation or testing.

Supplied Contents: Board(s)

Includes necessary boards for immediate evaluation and integration into projects.

Utilized IC / Part: TPS65023

Utilizes a specific IC for reliable performance and easy reference for replacements or upgrades.

Base Product Number: TPS65023

Clear identification of the base product simplifies ordering and sourcing additional components if needed.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

High moisture sensitivity level ensures component reliability even in challenging environmental conditions.

Technical Specifications

Additional Parts TPS65023EVM-205 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down with LDO

Other Names:

296-31267
TPS65023EVM-205-ND
TPS65023EVM205

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

1.5A, 1.2A, 800mA, 200mA, 200mA, 20mA

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

2.25MHz

Supplied Contents:

Board(s)

Voltage - Output:

1.1V, 1.3V, 1.55V, 2.5V, 3V, 3.3V

Board Type:

Fully Populated

Outputs and Type:

6, Non-Isolated

Utilized IC / Part:

TPS65023

Package:

Box

Voltage - Input:

3V ~ 5.5V

Base Product Number:

TPS65023

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS65023EVM-205 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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