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TPS62800YKAT

Texas Instruments

TPS62800YKAT by Texas Instruments

TPS62800YKAT by Texas Instruments is a switching regulator with max output current of 1A, operating temp range -40 to 125°C, and max switching frequency of 4MHz. Ideal for automotive applications due to its compact size and voltage-mode control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,339 parts In-Stock

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Vyrian

USA . 1,927 parts In-Stock

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Bristol Electronics

USA . 60 parts In-Stock

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Ampacity Inc.

Singapore . 1,210 parts In-Stock

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$3.500

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$3.500

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Semicontronic

India . 1,284 parts In-Stock

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$4.500

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$4.388

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$4.365

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$4.500

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$4.365

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One Stop Electronics

USA . 1,491 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 887 parts In-Stock

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$9.217

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887

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Parana Technologies

USA . 2,077 parts In-Stock

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$20.765

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$20.911

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DigiPath Technology Company

USA . 942 parts In-Stock

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$22.865

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$21.036

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942

$22.865

$21.036

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ChromeModa Solutions

Germany . 822 parts In-Stock

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$23.332

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$19.132

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822

$23.332

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IDEA Electronic Components Group

UK . 396 parts In-Stock

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$23.332

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$22.165

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$20.999

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$23.332

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Component Stockers USA

USA . 435 parts In-Stock

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$99.990

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Corphita

USA . 4,907 parts In-Stock

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Microchip USA

USA . 312 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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Overview

Enhance efficiency and reliability with the TPS62800YKAT from Texas Instruments. This cutting-edge switching regulator offers superior performance in a compact package, making it ideal for automotive applications and beyond. With a maximum output current of 1A and a wide input voltage range, this product provides exceptional value and flexibility for your power management needs. Trust in Texas Instruments' reputation for quality and innovation, and experience the benefits of the TPS62800YKAT firsthand.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting onto PCBs, saving space and making assembly simpler.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to handle during assembly.

No. of Terminals: 6

Sufficient number of terminals for connectivity while keeping the design compact.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in various environments.

Minimum Output Voltage: 0.4 V

Low minimum output voltage allows for powering of devices requiring low voltage.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides accurate regulation of output voltage.

Terminal Position: BOTTOM

Bottom terminal position helps in better heat dissipation and thermal management.

Maximum Seated Height: 0.4 mm

Ultra-thin profile helps in space-constrained designs.

Width (mm): 0.704 mm

Compact width contributes to overall space savings on the PCB.

Other IC type: SWITCHING REGULATOR

Switching regulator provides efficient power conversion for longer battery life and reduced heat dissipation.

Nominal Input Voltage: 3.6 V

Suitable nominal input voltage for a variety of battery-powered applications.

Maximum Time At Peak Reflow Temperature (s): 30

Quick reflow time helps in efficient manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering during assembly.

Length: 1.054 mm

Compact length contributes to space-saving in the overall design.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature rating ensures reliability in automotive applications.

Maximum Switching Frequency: 4000 kHz

High switching frequency allows for efficient power conversion with minimal ripple.

Maximum Output Current: 1 A

Sufficient output current capability for powering a variety of loads.

Terminal Form: BALL

Ball terminals provide good electrical contact and reliability in connection.

Control Technique: PULSE WIDTH MODULATION

PWM control technique allows for precise regulation of output voltage.

Switcher Config: BUCK

Buck configuration is efficient for stepping down voltage and improving power efficiency.

Terminal Pitch: 0.35 mm

Fine terminal pitch allows for closer spacing of terminals on the PCB.

Minimum Input Voltage: 1.8 V

Low minimum input voltage allows for operation in low-power scenarios.

Nominal Output Voltage: 0.7 V

Sufficient nominal output voltage for powering low voltage devices.

Maximum Input Voltage: 5.5 V

Wide input voltage range enables compatibility with a variety of power sources.

Technical Specifications

Switching Regulators & Controllers TPS62800YKAT attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN PFM MODE; ADJUSTABLE OUTPUT VOLTAGE IS 0.4 V TO 0.775 V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.8 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-XBGA-B6

Length:

1.054 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1 A

Minimum Output Voltage:

.4 V

Nominal Output Voltage:

.7 V

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.4 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

4000 kHz

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

.704 mm

Trade Compliance

TPS62800YKAT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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