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TPS62621EVM-419

Texas Instruments

TPS62621EVM-419 by Texas Instruments

TPS62621EVM-419 by Texas Instruments is a DC/DC evaluation board with 1.8V output voltage and 600mA output current. It operates at an input voltage range of 2.3V to 5.5V, utilizing the TPS62621 IC in a Buck topology at a switching frequency of 6MHz. This fully populated board is ideal for testing DC/DC step-down applications.

Median Price

$49.000

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 3 parts In-Stock

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$49.000

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Digiode

USA . 1,616 parts In-Stock

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$46.550

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Vyrian

USA . 2,418 parts In-Stock

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Ampacity Inc.

Singapore . 2 parts In-Stock

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$41.650

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Corphita

USA . 2,873 parts In-Stock

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$44.100

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Corohmni

South Africa . 206 parts In-Stock

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$49.000

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Semicontronic

India . 2 parts In-Stock

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$90.650

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$88.384

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$87.930

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$90.650

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$87.930

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ChromeModa Solutions

Germany . 2,515 parts In-Stock

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Parana Technologies

USA . 1,739 parts In-Stock

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$0.702

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IDEA Electronic Components Group

UK . 784 parts In-Stock

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DigiPath Technology Company

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Perfect Parts

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the TPS62621EVM-419. This development board offers exceptional performance in DC/DC step-down applications, delivering a stable 1.8V output at 600mA. Perfect for a variety of projects, this evaluation board showcases the cutting-edge Buck regulator topology and operates at a fast switching frequency of 6MHz. Trust in Texas Instruments to provide top-of-the-line solutions for your power management needs. Unlock the potential of your designs with the TPS62621EVM-419.

Feature Benefit Bullets

Other Names: 296-31260, TPS62621EVM-419-ND, TPS62621EVM419

Multiple names for easy identification and compatibility with various part numbers and systems.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Versatile usage for development and evaluation purposes.

Main Purpose: DC/DC, Step Down

Specifically designed for DC/DC step-down applications.

Voltage - Output: 1.8V

Stable and precise output voltage for various electronic components.

Current - Output: 600mA

Adequate output current for powering a range of devices.

Voltage - Input: 2.3V ~ 5.5V

Wide input voltage range for flexibility in power source selection.

Regulator Topology: Buck

Efficient buck regulator design for power conversion.

Frequency - Switching: 6MHz

High switching frequency for reduced component size and increased efficiency.

Board Type: Fully Populated

Ready-to-use board with all necessary components assembled.

Supplied Contents: Board(s)

Includes required board(s) for immediate testing and implementation.

Utilized IC / Part: TPS62621

Specific IC/part for seamless integration and reliable performance.

Base Product Number: TPS62621

Standard product number for easy reference and compatibility.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for various environmental conditions with unlimited moisture sensitivity level.

Technical Specifications

Additional Parts TPS62621EVM-419 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

296-31260
TPS62621EVM-419-ND
TPS62621EVM419

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

600mA

Standard Package:

1

Regulator Topology:

Buck

Frequency - Switching:

6MHz

Supplied Contents:

Board(s)

Voltage - Output:

1.8V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS62621

Package:

Box

Voltage - Input:

2.3V ~ 5.5V

Base Product Number:

TPS62621

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS62621EVM-419 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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