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TPS62007DGSG4

Texas Instruments

TPS62007DGSG4 by Texas Instruments

TPS62007DGSG4 by Texas Instruments is a switching regulator with a max output current of 0.6A and a max operating temperature of 85°C. It operates in buck configuration, has a min input voltage of 2V, and is suitable for industrial applications requiring efficient power management.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,824 parts In-Stock

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Martec Srl

Italy . 1,040 parts In-Stock

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Digiode

USA . 304 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 45 parts In-Stock

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Holdelec - ElecDif-Pro

France . 45 parts In-Stock

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One Stop Electronics

USA . 1,513 parts In-Stock

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$0.500

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$0.500

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Parana Technologies

USA . 1,893 parts In-Stock

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$5.101

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$5.685

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DigiPath Technology Company

USA . 1,607 parts In-Stock

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$5.617

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ChromeModa Solutions

Germany . 6,822 parts In-Stock

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$5.732

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$4.700

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IDEA Electronic Components Group

UK . 787 parts In-Stock

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$5.732

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$5.159

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AZTECH Wire

Italy . 240 parts In-Stock

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$6.001

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Microchip USA

USA . 1,472 parts In-Stock

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Corphita

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Glotronic Ltd.

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Overview

Unleash the power of cutting-edge technology with the TPS62007DGSG4 by Texas Instruments, a top-tier manufacturer known for delivering superior quality products. As part of the Switching Regulators & Controllers category, this innovative device offers unmatched efficiency and reliability for various applications. From its compact design to advanced control techniques, this switching regulator provides customers with exceptional value and benefits. Elevate your projects to new heights with the TPS62007DGSG4 and experience the advantages of state-of-the-art technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, perfect for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand demanding industrial environments.

Minimum Output Voltage: 3.3 V

The minimum output voltage of 3.3 V ensures a stable power supply for devices requiring a consistent voltage level.

Control Mode: CURRENT-MODE

Operating in current-mode control allows for better responsiveness and stability in regulating the output voltage.

Maximum Switching Frequency: 1000 kHz

The high maximum switching frequency of 1000 kHz enables efficient power conversion and minimizes energy loss.

Maximum Output Current: 0.6 A

With a maximum output current of 0.6 A, this product can deliver sufficient power for various applications without overheating.

Technical Specifications

Switching Regulators & Controllers TPS62007DGSG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

PFM CONTROL TECHNIQUE IS ALSO POSSIBLE

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.6 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

3.3 V

Nominal Output Voltage:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1000 kHz

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS62007DGSG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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