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TPS61181AEVM-259

Texas Instruments

TPS61181AEVM-259 by Texas Instruments

TPS61181AEVM-259 by Texas Instruments is an LED driver evaluation board with 6 non-isolated outputs, each delivering 1.5A at a max output voltage of 38V. It operates within an input voltage range of 4.5V to 24V and utilizes the TPS61181A IC, making it ideal for testing LED driver applications in various settings.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 39 parts In-Stock

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$49.000

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DigiKey

USA . 1 parts In-Stock

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$58.800

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$58.800

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Digiode

USA . 758 parts In-Stock

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$46.550

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758

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Vyrian

USA . 3,324 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 21 parts In-Stock

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$41.650

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Semicontronic

India . 21 parts In-Stock

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$41.650

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$40.609

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$40.400

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$40.400

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Corphita

USA . 4,097 parts In-Stock

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$44.100

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Corohmni

South Africa . 204 parts In-Stock

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$49.000

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204

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Component Stockers USA

USA . 1 parts In-Stock

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$57.220

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1

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ChromeModa Solutions

Germany . 5,314 parts In-Stock

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IDEA Electronic Components Group

UK . 2,365 parts In-Stock

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DigiPath Technology Company

USA . 1,653 parts In-Stock

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Parana Technologies

USA . 14 parts In-Stock

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$1.394

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Discover the innovative TPS61181AEVM-259 by Texas Instruments, a top-tier LED driver evaluation board that offers unmatched quality and reliability. Manufactured by the industry leader in semiconductor technology, this product is perfect for development projects and applications requiring efficient power management solutions. With a current output of 1.5A and 6 non-isolated outputs, this board provides exceptional performance and versatility. Experience the value and benefits that the TPS61181AEVM-259 brings to your projects with its cutting-edge technology and robust design, making it an essential tool for your development needs.

Feature Benefit Bullets

Other Names: 296-31232

Easy to search and identify the product with a unique identifier.

Category: Development Boards, Kits, Programmers, Evaluation Boards, LED Driver Evaluation Boards

Versatile usage for development and evaluation purposes in LED driver applications.

Package: Box

Provides protection and convenience for the product during storage and transportation.

Current - Output / Channel: 1.5A

High output current capability for driving LED loads efficiently.

Outputs and Type: 6, Non-Isolated

Multiple non-isolated outputs for flexible LED driver configurations.

Voltage - Output: 38V

Suitable voltage output for driving LED circuits with different requirements.

Voltage - Input: 4.5V ~ 24V

Wide input voltage range allows compatibility with various power sources.

Supplied Contents: Board(s)

Includes necessary boards for immediate evaluation and testing of the LED driver.

Utilized IC / Part: TPS61181A

Utilization of TPS61181A IC ensures reliable and efficient performance.

Base Product Number: TPS61181

Indicates compatibility and interchangeability with other TPS61181 products.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

No moisture sensitivity concerns, suitable for various environmental conditions.

Technical Specifications

Additional Parts TPS61181AEVM-259 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31232
TPS61181AEVM259
TPS61181AEVM-259-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards LED Driver Evaluation Boards

Supplied Contents:

Board(s)

Voltage - Output:

38V

Outputs and Type:

6, Non-Isolated

Utilized IC / Part:

TPS61181A

Package:

Box

Current - Output / Channel:

1.5A

Voltage - Input:

4.5V ~ 24V

Standard Package:

1

Base Product Number:

TPS61181

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS61181AEVM-259 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8504.40.9580

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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