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TPS61121PWRG4

Texas Instruments

TPS61121PWRG4 by Texas Instruments

TPS61121PWRG4 by Texas Instruments is a switching regulator with 16 terminals, operating temperature range of -40 to 85°C, and max output current of 1.6A. It is used as a battery charge controller in industrial applications due to its boost switcher configuration and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,857 parts In-Stock

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Vyrian

USA . 2,276 parts In-Stock

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2,276

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Ampacity Inc.

Singapore . 1,630 parts In-Stock

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$4.500

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1,630

$4.500

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Semicontronic

India . 1,368 parts In-Stock

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$5.500

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$5.362

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$5.335

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1,368

$5.500

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$5.335

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One Stop Electronics

USA . 1,545 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 488 parts In-Stock

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$9.923

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488

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Parana Technologies

USA . 1,720 parts In-Stock

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$19.997

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$1,857.063

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$17.998

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1,720

$19.997

$1,857.063

$17.998

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DigiPath Technology Company

USA . 1,007 parts In-Stock

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$22.020

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$22.020

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

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$22.469

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$21.346

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$20.222

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1,112

$22.469

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$20.222

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ChromeModa Solutions

Germany . 314 parts In-Stock

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$22.469

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$18.425

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314

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Corphita

USA . 1,549 parts In-Stock

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Microchip USA

USA . 346 parts In-Stock

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Corohmni

South Africa . 294 parts In-Stock

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Overview

Looking for a reliable and high-quality solution for your switching regulator needs? Look no further than the TPS61121PWRG4 by Texas Instruments. With years of experience and expertise in the field, Texas Instruments ensures top-notch performance and efficiency. This versatile regulator is perfect for a wide range of applications, offering customers value, benefits, and advantages that are unmatched. Say goodbye to worries about power management with the TPS61121PWRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and safeguards the internal components of the switching regulator, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

No. of Terminals: 16

Having a higher number of terminals allows for more connectivity options, making it versatile for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this switching regulator can withstand harsh environmental conditions, increasing its reliability.

Control Mode: CURRENT-MODE

Current-mode control provides precise regulation of output, ensuring stable performance under varying load conditions.

Width (mm): 4.4 mm

The compact width of the package makes it suitable for space-constrained applications, offering flexibility in design.

Nominal Input Voltage: 3.3 V

The specified input voltage range allows for compatibility with a variety of power sources, enhancing its usability.

Maximum Output Current: 1.6 A

The high maximum output current capability makes it suitable for powering a wide range of electronic devices efficiently.

Technical Specifications

Switching Regulators & Controllers TPS61121PWRG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

1.8 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-PDSO-G16

Length:

5 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

600 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS61121PWRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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