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TPS60200EVM-145

Texas Instruments

TPS60200EVM-145 by Texas Instruments

TPS60200EVM-145 by Texas Instruments is a DC/DC SMPS Evaluation Board with 3.3V output voltage, 100mA current output, and Boost regulator topology. It operates on 1.6V to 3.6V input voltage range, suitable for DC/DC Step Up applications utilizing TPS60200 IC in Fully Populated board format.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,867 parts In-Stock

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Digiode

USA . 3,932 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$8.487

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362

$8.487

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One Stop Electronics

USA . 221 parts In-Stock

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$60.100

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221

$60.100

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Ampacity Inc.

Singapore . 762 parts In-Stock

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$99.100

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762

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Semicontronic

India . 642 parts In-Stock

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$171.100

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$166.822

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$165.967

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642

$171.100

$166.822

$165.967

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IDEA Electronic Components Group

UK . 2,248 parts In-Stock

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Parana Technologies

USA . 1,913 parts In-Stock

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$1.402

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$1.402

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DigiPath Technology Company

USA . 1,592 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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Corphita

USA . 417 parts In-Stock

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417

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ChromeModa Solutions

Germany . 334 parts In-Stock

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334

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock unlimited possibilities with the TPS60200EVM-145 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that exceed expectations. The TPS60200EVM-145 falls under the category of Development Boards, Kits, and Programmers, offering a convenient solution for DC/DC Step Up applications. With a 3.3V output voltage and 100mA output current, this evaluation board provides efficient power conversion for various projects. Experience the value and benefits of this versatile product, designed to meet your specific needs and deliver exceptional performance. Elevate your projects with the TPS60200EVM-145 today.

Feature Benefit Bullets

Other Names

Unique identifier for easy reference and ordering.

Category

Suitable for those looking to evaluate and test DC/DC & AC/DC SMPS.

Package

Allows for easy handling and storage of multiple units.

Main Purpose

Specifically designed for boosting DC voltage levels.

Outputs and Type

Provides a single non-isolated output for simplicity.

Voltage - Output

Stable output voltage suitable for various applications.

Current - Output

A moderate output current for low-power applications.

Voltage - Input

Wide input voltage range for flexibility in power sources.

Regulator Topology

Efficient boost regulator topology for increasing voltage levels.

Board Type

Ready-to-use board with all necessary components populated.

Supplied Contents

Includes board(s) for immediate testing and evaluation.

Utilized IC / Part

Designed around the TPS60200 IC for reliable performance.

Base Product Number

Part of the TPS602 series with known quality and performance.

Moisture Sensitivity Level (MSL)

Suitable for use in various environmental conditions.

Technical Specifications

Additional Parts TPS60200EVM-145 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Up

Other Names:

-296-10955
-TPS60200EVM-145-NDR
296-10955
296-10955-NDR
-296-10955-ND
-TPS60200EVM

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

100mA

Standard Package:

1

Regulator Topology:

Boost

Supplied Contents:

Board(s)

Voltage - Output:

3.3V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS60200

Package:

Bulk

Voltage - Input:

1.6V ~ 3.6V

Base Product Number:

TPS602

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS60200EVM-145 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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