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TPS56221EVM-579

Texas Instruments

TPS56221EVM-579 by Texas Instruments

TPS56221EVM-579 by Texas Instruments is a SWIFT™ series DC/DC evaluation board with 1V non-isolated output, 25A current, and 8V ~ 14V input voltage. It utilizes TPS56221 IC for step-down regulation at 500kHz switching frequency. Ideal for testing DC/DC converters in various applications.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Newark

USA . 2 parts In-Stock

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$6.280

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Texas Instruments

USA . 6 parts In-Stock

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$49.000

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DigiKey

USA . 1 parts In-Stock

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$58.800

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$58.800

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Mouser Electronics

USA . 2 parts In-Stock

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$58.810

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$58.810

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Digiode

USA . 1,077 parts In-Stock

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$5.966

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1,077

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Vyrian

USA . 8,652 parts In-Stock

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8,652

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Ampacity Inc.

Singapore . 3 parts In-Stock

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$5.340

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$5.340

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Semicontronic

India . 3 parts In-Stock

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$5.340

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$5.206

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$5.180

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3

$5.340

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$5.180

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Corphita

USA . 4,668 parts In-Stock

1+ parts

$5.652

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4,668

$5.652

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Corohmni

South Africa . 255 parts In-Stock

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$6.280

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255

$6.280

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Parana Technologies

USA . 1,899 parts In-Stock

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$1.385

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ChromeModa Solutions

Germany . 957 parts In-Stock

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IDEA Electronic Components Group

UK . 125 parts In-Stock

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DigiPath Technology Company

USA . 58 parts In-Stock

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Perfect Parts

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Overview

Looking to power your electronics efficiently and reliably? The TPS56221EVM-579 by Texas Instruments is the solution you need. With its top-notch quality and cutting-edge technology, Texas Instruments guarantees superior performance in DC/DC applications. This development board is perfect for evaluating SMPS designs, making it ideal for engineers and hobbyists alike. Experience the value of smooth, regulated power with the TPS56221EVM-579 and take your projects to the next level.

Feature Benefit Bullets

Main Purpose: DC/DC, Step Down

Specifically designed for DC/DC applications with step-down functionality, ensuring efficiency and precise voltage regulation.

Voltage - Output: 1V

Provides a stable output voltage of 1V, suitable for various low voltage applications.

Current - Output: 25A

Capable of delivering a high output current of 25A, making it suitable for power-hungry devices and applications.

Voltage - Input: 8V ~ 14V

Accepts a wide input voltage range of 8V to 14V, allowing flexibility in power source selection.

Regulator Topology: Buck

Utilizes a buck regulator topology, known for its high efficiency and simple design, making it a reliable choice for voltage regulation.

Frequency - Switching: 500kHz

Operates at a switching frequency of 500kHz, offering fast response time and minimized power loss.

Board Type: Fully Populated

Comes fully populated with components, saving time and effort in assembling, making it ready for immediate use and testing.

Utilized IC / Part: TPS56221

Features the TPS56221 IC which is well-known for its high performance and efficiency in DC/DC converters.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Has a moisture sensitivity level of 1, indicating that it can be exposed to unlimited floor life conditions without issue, ensuring long-term reliability.

Technical Specifications

Additional Parts TPS56221EVM-579 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

296-28389
TPS56221EVM579

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

25A

Standard Package:

1

Series:

SWIFT™

Regulator Topology:

Buck

Frequency - Switching:

500kHz

Supplied Contents:

Board(s)

Voltage - Output:

1V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS56221

Package:

Bulk

Voltage - Input:

8V ~ 14V

Base Product Number:

TPS56221

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS56221EVM-579 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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