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TPS55010EVM-051

Texas Instruments

TPS55010EVM-051 by Texas Instruments

TPS55010EVM-051 by Texas Instruments is a Fly-buck™ series DC/DC evaluation board with 2 isolated outputs of ±14V to ±21V at 40mA each. It operates on an input voltage range of 3V to 6V, featuring Buck and Flyback regulator topologies with a switching frequency of 400kHz. This fully populated board is designed for evaluating the TPS55010-051 IC in various step-up or step-down applications.

Median Price

$61.985

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 64 parts In-Stock

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Vyrian

USA . 4,722 parts In-Stock

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Digiode

USA . 1,628 parts In-Stock

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Semicontronic

India . 1,396 parts In-Stock

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$3.100

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$3.022

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$3.007

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AZTECH Wire

Italy . 638 parts In-Stock

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Component Stockers USA

USA . 534 parts In-Stock

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One Stop Electronics

USA . 1,386 parts In-Stock

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Ampacity Inc.

Singapore . 1,128 parts In-Stock

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$221.100

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Corphita

USA . 3,051 parts In-Stock

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DigiPath Technology Company

USA . 2,022 parts In-Stock

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ChromeModa Solutions

Germany . 984 parts In-Stock

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Parana Technologies

USA . 542 parts In-Stock

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Corohmni

South Africa . 272 parts In-Stock

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IDEA Electronic Components Group

UK . 24 parts In-Stock

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Overview

Unlock the power of efficient power management with the TPS55010EVM-051 by Texas Instruments. This development board is a game-changer in the DC/DC & AC/DC SMPS Evaluation Boards category, offering customers an easy and reliable solution for their power supply needs. With its Fly-buck™ series and Buck/Flyback regulator topology, this board provides ±14V ~ ±21V outputs at 40mA each, making it ideal for a wide range of applications. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the TPS55010EVM-051 brings to your projects.

Feature Benefit Bullets

Other Names: TPS55010EVM051

Easy to identify and search for when looking for this specific evaluation board.

Category: Development Boards, Kits, Programmers - Evaluation Boards

Designed for evaluation purposes, making it easy for engineers to test and assess the performance of the DC/DC and AC/DC SMPS system.

Outputs and Type: 2, Isolated

Allows for multiple outputs that are isolated, providing flexibility in power distribution and reducing potential interference between circuits.

Voltage - Output: ±14V ~ ±21V

Offers a wide range of output voltages, suitable for various applications requiring different voltage levels.

Current - Output: 40mA, 40mA

Can deliver a consistent current output of up to 40mA, providing stable power supply for connected devices.

Voltage - Input: 3V ~ 6V

Accepts a wide range of input voltages, making it compatible with different power sources and allowing for versatility in application.

Regulator Topology: Buck, Flyback

Utilizes efficient buck and flyback regulator topologies, ensuring optimal power conversion and performance.

Frequency - Switching: 400kHz

Operates at a high switching frequency of 400kHz, providing fast response times and efficient power conversion.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be used in various environments without being affected by moisture, making it reliable and durable.

Technical Specifications

Additional Parts TPS55010EVM-051 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Up or Down

Other Names:

TPS55010EVM051
296-31208
TPS55010EVM-051-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

40mA, 40mA

Standard Package:

1

Series:

Fly-buck™

Regulator Topology:

Buck, Flyback

Frequency - Switching:

400kHz

Supplied Contents:

Board(s)

Voltage - Output:

±14V ~ ±21V

Board Type:

Fully Populated

Outputs and Type:

2, Isolated

Utilized IC / Part:

TPS55010-051

Package:

Box

Voltage - Input:

3V ~ 6V

Base Product Number:

TPS55010

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS55010EVM-051 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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