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TPS54617RUVR/2801

Texas Instruments

TPS54617RUVR/2801 by Texas Instruments

SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 34; Package Code: HVQCCN; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,347 parts In-Stock

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4,347

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Digiode

USA . 2,398 parts In-Stock

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2,398

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,453 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,453

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 1,152 parts In-Stock

1+ parts

$1.500

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1,152

$1.500

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One Stop Electronics

USA . 652 parts In-Stock

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$3.500

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652

$3.500

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Parana Technologies

USA . 140 parts In-Stock

1+ parts

$11.319

100+ parts

-

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$11.751

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140

$11.319

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$11.751

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AZTECH Wire

Italy . 791 parts In-Stock

1+ parts

$12.457

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791

$12.457

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DigiPath Technology Company

USA . 1,213 parts In-Stock

1+ parts

$12.464

100+ parts

$11.467

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1,213

$12.464

$11.467

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ChromeModa Solutions

Germany . 6,402 parts In-Stock

1+ parts

$12.718

100+ parts

$10.429

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6,402

$12.718

$10.429

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IDEA Electronic Components Group

UK . 1,655 parts In-Stock

1+ parts

$12.718

100+ parts

$12.082

1k+ parts

$11.446

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1,655

$12.718

$12.082

$11.446

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QUARKTWIN TECHNOLOGY LTD

USA . 21,127 parts In-Stock

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21,127

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Microchip USA

USA . 4,794 parts In-Stock

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4,794

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Corphita

USA . 3,758 parts In-Stock

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3,758

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Corohmni

South Africa . 60 parts In-Stock

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60

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Technical Specifications

Switching Regulators & Controllers TPS54617RUVR/2801 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ADJUSTABLE VOLTAGE MIN 0.9 V

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

6 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

3.6 V

JESD-30 Code:

R-PQCC-N34

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

34

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Maximum Output Voltage:

3.3 V

Minimum Output Voltage:

.9 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1600 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.5 mm

Trade Compliance

TPS54617RUVR/2801 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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