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TPS54350EVM-235

Texas Instruments

TPS54350EVM-235 by Texas Instruments

TPS54350EVM-235 by Texas Instruments is a SWIFT™ series DC/DC evaluation board with 3.3V output voltage, 3A output current, and 6V to 18V input voltage range. It utilizes the TPS54350 regulator for step-down applications in development boards and kits. The board features a buck topology, switching frequency of 500kHz, and is fully populated for easy evaluation.

Median Price

$58.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18 parts In-Stock

1+ parts

$49.000

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18

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DigiKey

USA . 4 parts In-Stock

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$58.800

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4

$58.800

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Mouser Electronics

USA . 1 parts In-Stock

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$58.810

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1

$58.810

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Digiode

USA . 3,238 parts In-Stock

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$46.550

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$46.550

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Vyrian

USA . 4,300 parts In-Stock

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4,300

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Semicontronic

India . 8 parts In-Stock

1+ parts

$41.650

100+ parts

$40.609

1k+ parts

$40.400

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8

$41.650

$40.609

$40.400

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Corphita

USA . 4,394 parts In-Stock

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$44.100

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$44.100

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Corohmni

South Africa . 254 parts In-Stock

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$49.000

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254

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Ampacity Inc.

Singapore . 8 parts In-Stock

1+ parts

$90.650

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8

$90.650

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ChromeModa Solutions

Germany . 6,098 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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3,000

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DigiPath Technology Company

USA . 1,222 parts In-Stock

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Parana Technologies

USA . 354 parts In-Stock

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$0.120

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354

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IDEA Electronic Components Group

UK . 321 parts In-Stock

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Perfect Parts

USA . 2 parts In-Stock

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Overview

Unlock the power of efficient voltage regulation with the TPS54350EVM-235 by Texas Instruments. Crafted with precision and quality, this development board is designed for DC/DC step-down applications, offering a stable 3.3V output at 3A. Perfect for evaluation and prototyping, this SWIFT™ series board provides a reliable solution for your power management needs. Experience the benefits of Texas Instruments' trusted technology in a compact package, delivering high performance and value to customers in a variety of industries. Elevate your projects with the TPS54350EVM-235 and discover the difference excellence makes.

Feature Benefit Bullets

Other Names: 296-18962-NDR

This product is easy to identify and search for with multiple names.

Category: Development Boards, Kits, Programmers

This product is designed for development purposes, making it a versatile choice for use in various projects.

Voltage - Output: 3.3V

Provides a stable output voltage of 3.3V, suitable for many applications.

Current - Output: 3A

Capable of delivering a high output current of 3A, making it suitable for powering different components.

Voltage - Input: 6V ~ 18V

Can accept a wide input voltage range of 6V to 18V, allowing flexibility in power source selection.

Regulator Topology: Buck

Features a buck regulator topology, known for its efficiency in stepping down voltage levels.

Frequency - Switching: 500kHz

Operates at a high switching frequency of 500kHz, offering fast response times and minimizing output voltage ripple.

Technical Specifications

Additional Parts TPS54350EVM-235 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

-296-18962-NDR
-296-18962
-TPS54350EVM
-296-18962-ND
296-18962
296-18962-NDR
-TPS54350EVM-235-NDR
TPS54350EVM235

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

3A

Standard Package:

1

Series:

SWIFT™

Regulator Topology:

Buck

Frequency - Switching:

500kHz

Supplied Contents:

Board(s)

Voltage - Output:

3.3V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS54350

Package:

Bulk

Voltage - Input:

6V ~ 18V

Base Product Number:

TPS54350

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS54350EVM-235 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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