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TPS5431DDARG4

Texas Instruments

TPS5431DDARG4 by Texas Instruments

TPS5431DDARG4 by Texas Instruments is a switching regulator with 3A output current, 1.23V min output voltage, and 500kHz max switching frequency. Ideal for automotive applications due to its -40 to 125°C operating temperature range and VOLTAGE-MODE control mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 38,500 parts In-Stock

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38,500

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Vyrian

USA . 8,982 parts In-Stock

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8,982

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Digiode

USA . 4,164 parts In-Stock

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4,164

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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One Stop Electronics

USA . 600 parts In-Stock

1+ parts

$0.500

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600

$0.500

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Parana Technologies

USA . 493 parts In-Stock

1+ parts

$4.481

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$4.917

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493

$4.481

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$4.917

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DigiPath Technology Company

USA . 735 parts In-Stock

1+ parts

$4.934

100+ parts

$4.540

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735

$4.934

$4.540

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ChromeModa Solutions

Germany . 6,404 parts In-Stock

1+ parts

$5.035

100+ parts

$4.129

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6,404

$5.035

$4.129

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

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$5.035

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$4.532

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1,261

$5.035

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$4.532

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Ampacity Inc.

Singapore . 1,244 parts In-Stock

1+ parts

$7.500

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1,244

$7.500

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AZTECH Wire

Italy . 367 parts In-Stock

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$8.395

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367

$8.395

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Microchip USA

USA . 1,834 parts In-Stock

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1,834

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Corphita

USA . 991 parts In-Stock

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991

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Experience reliable and efficient power management with the TPS5431DDARG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and innovative solutions. The TPS5431DDARG4 falls under Switching Regulators & Controllers, offering a wide range of applications. With its voltage-mode control, pulse width modulation, and buck switcher configuration, this product ensures optimal performance. Its compact design, high output current of 3A, and automotive temperature grade make it ideal for various projects. Trust in Texas Instruments for cutting-edge technology and seamless integration into your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting performance.

Surface Mount: YES

Easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

Sleek and compact design for efficient use of space.

No. of Terminals: 8

Sufficient number of terminals for easy connectivity and power distribution.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without compromising performance.

Minimum Output Voltage: 1.23 V

Ability to provide low output voltage for a variety of applications.

Control Mode: VOLTAGE-MODE

Efficient control mode for regulating voltage output.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for reliable connections.

Maximum Output Voltage: 20 V

Can provide high output voltage for powering various devices.

Terminal Position: DUAL

Dual terminal position for added flexibility in installation.

Maximum Seated Height: 1.68 mm

Low profile design for space-constrained applications.

Width (mm): 3.9 mm

Compact width for easy integration into different systems.

Other IC type: SWITCHING REGULATOR

Efficient switching regulator design for stable and precise output voltage.

Nominal Input Voltage: 12 V

Optimal input voltage for efficient power conversion.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a short duration.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for robust performance.

Length: 4.89 mm

Compact length for convenient installation in tight spaces.

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications requiring temperature resilience.

Maximum Switching Frequency: 500 kHz

High switching frequency for fast and efficient power conversion.

Maximum Output Current: 3 A

Can deliver high output current for powering various devices.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections.

Control Technique: PULSE WIDTH MODULATION

Precise control technique for accurate voltage regulation.

Switcher Config: BUCK

Buck switcher configuration for efficient power conversion.

Terminal Pitch: 1.27 mm

Optimal terminal pitch for easy soldering and connectivity.

Minimum Input Voltage: 5.5 V

Low minimum input voltage for versatile compatibility.

Maximum Input Voltage: 23 V

High maximum input voltage for compatibility with various power sources.

Technical Specifications

Switching Regulators & Controllers TPS5431DDARG4 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

23 V

Minimum Input Voltage:

5.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.89 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Maximum Output Voltage:

20 V

Minimum Output Voltage:

1.23 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.68 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS5431DDARG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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