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TPS54060QDGQRQ1

Texas Instruments

TPS54060QDGQRQ1 by Texas Instruments

TPS54060QDGQRQ1 by Texas Instruments is a switching regulator with a current-mode control mode, operating b/w -40 to 125°C. It has a buck switcher configuration, supports input voltages from 3.5V to 60V, and is ideal for automotive applications due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,540 parts In-Stock

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6,540

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Bristol Electronics

USA . 3,220 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Digiode

USA . 2,182 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 1,971 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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One Stop Electronics

USA . 1,096 parts In-Stock

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$0.500

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$0.500

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Ampacity Inc.

Singapore . 1,230 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 1,564 parts In-Stock

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$9.380

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$10.000

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$9.380

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DigiPath Technology Company

USA . 1,439 parts In-Stock

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$10.328

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ChromeModa Solutions

Germany . 5,480 parts In-Stock

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$10.539

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$8.642

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$10.539

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IDEA Electronic Components Group

UK . 864 parts In-Stock

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$10.539

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$10.012

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$9.485

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864

$10.539

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AZTECH Wire

Italy . 820 parts In-Stock

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$18.433

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Kepictronics

USA . 3,935 parts In-Stock

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Corphita

USA . 2,613 parts In-Stock

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Authorized Procurement Solutions

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Aranea Global

USA . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 360 parts In-Stock

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Microchip USA

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Lixinc

USA . 91 parts In-Stock

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Overview

Experience high-quality performance with the TPS54060QDGQRQ1 by Texas Instruments, a top-tier manufacturer known for their cutting-edge technology. This switching regulator is perfect for automotive applications, offering reliable power control and efficiency. With its compact design and advanced features, this product ensures optimal performance in a wide range of scenarios. Trust Texas Instruments to deliver innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount capability makes it easy to integrate into PCBs for efficient assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance for automotive applications.

Package Shape: SQUARE

Square shape allows for compact placement on the PCB, saving valuable space.

No. of Terminals: 10

Having 10 terminals provides flexibility in connectivity and functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style enhances portability and ease of installation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures stability in a variety of environmental conditions.

Control Mode: CURRENT-MODE

Current-mode control technique offers precise regulation and stability.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish enhances conductivity and ensures long-term reliability.

Terminal Position: DUAL

Dual terminal positions provide options for different PCB layouts.

Maximum Seated Height: 1.1 mm

Low seated height enables a compact design and efficient use of space.

Width (mm): 3 mm

Narrow width makes it suitable for applications with space constraints.

Other IC type: SWITCHING REGULATOR

Being a switching regulator provides efficient power conversion with minimal heat dissipation.

Nominal Input Voltage: 12 V

Nominal input voltage of 12V matches common power supply standards.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering processes during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints during assembly.

Length: 3 mm

Compact length allows for a space-saving design.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications where reliability and performance are critical.

Maximum Switching Frequency: 2500 kHz

High switching frequency enables fast response times and efficient power conversion.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and ease of soldering.

Control Technique: PULSE WIDTH MODULATION

PWM control technique offers precise power regulation and efficiency.

Switcher Config: BUCK

Buck configuration provides step-down voltage conversion for efficient power management.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts and integration.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product can withstand moderate levels of moisture exposure.

Minimum Input Voltage: 3.5 V

Low minimum input voltage enables operation in low-power scenarios.

Maximum Input Voltage: 60 V

High maximum input voltage range allows for a wide range of power supply options.

Technical Specifications

Switching Regulators & Controllers TPS54060QDGQRQ1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

60 V

Minimum Input Voltage:

3.5 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

TPS54060QDGQRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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