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TPS51117EVM

Texas Instruments

TPS51117EVM by Texas Instruments

TPS51117EVM by Texas Instruments is a D-CAP™ DC/DC SMPS Evaluation Board with 1.05V output voltage and 10A output current. It operates on an input voltage range of 6V to 21V, featuring Buck regulator topology and a switching frequency of 350kHz. This fully populated board is designed for evaluating the TPS51117 IC in DC/DC step-down applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 3,601 parts In-Stock

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Vyrian

USA . 3,083 parts In-Stock

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AZTECH Wire

Italy . 598 parts In-Stock

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$14.884

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Ampacity Inc.

Singapore . 1,518 parts In-Stock

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$31.100

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One Stop Electronics

USA . 647 parts In-Stock

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Semicontronic

India . 1,064 parts In-Stock

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$59.100

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$57.327

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Corphita

USA . 3,849 parts In-Stock

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Parana Technologies

USA . 2,296 parts In-Stock

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$0.959

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DigiPath Technology Company

USA . 1,894 parts In-Stock

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

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Corohmni

South Africa . 389 parts In-Stock

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ChromeModa Solutions

Germany . 213 parts In-Stock

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Perfect Parts

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Overview

Discover the power of the TPS51117EVM by Texas Instruments, a top-tier manufacturer known for its high-quality products. This development board is perfect for applications requiring DC/DC step-down conversion, offering a non-isolated 1.05V output at up to 10A. With its efficient Buck regulator topology and D-CAP™ series design, this evaluation board is a valuable tool for engineers looking to optimize their power supply solutions. Unlock the potential of your projects with the reliable performance and versatility of the TPS51117EVM.

Feature Benefit Bullets

Other Names: 296-31163, TPS51117EVM-ND

These are alternative identifiers for the product, making it easy to search and purchase.

Category: Development Boards, Kits, Programmers, Evaluation Boards

This indicates that the product is designed for evaluation and testing purposes, ensuring reliability and performance.

Outputs and Type: 1, Non-Isolated

Provides a single output that is non-isolated, simplifying the design and reducing complexity.

Voltage - Output: 1.05V

Delivers a specific output voltage, suitable for various applications requiring precise voltage regulation.

Current - Output: 10A

Capable of delivering high current output, making it suitable for power-hungry devices or circuits.

Voltage - Input: 6V ~ 21V

Accepts a wide range of input voltages, providing flexibility in powering the device from various sources.

Regulator Topology: Buck

Uses buck regulator topology, offering efficient voltage conversion and step-down capabilities.

Frequency - Switching: 350kHz

Operates at a high switching frequency, enabling smaller components and improved efficiency in power conversion.

Supplied Contents: Board(s)

Comes fully populated with boards, ready for immediate testing and evaluation.

Utilized IC / Part: TPS51117

Features the TPS51117 integrated circuit, known for its high performance and reliability in power management.

Technical Specifications

Additional Parts TPS51117EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Main Purpose:

DC/DC, Step Down

Other Names:

296-31163
TPS51117EVM-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards DC/DC & AC/DC (Off-Line) SMPS Evaluation Boards

Current - Output:

10A

Standard Package:

1

Series:

D-CAP™

Regulator Topology:

Buck

Frequency - Switching:

350kHz

Supplied Contents:

Board(s)

Voltage - Output:

1.05V

Board Type:

Fully Populated

Outputs and Type:

1, Non-Isolated

Utilized IC / Part:

TPS51117

Package:

Box

Voltage - Input:

6V ~ 21V

Base Product Number:

TPS511

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS51117EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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