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TPS2590EVM

Texas Instruments

TPS2590EVM by Texas Instruments

TPS2590EVM by Texas Instruments is an Evaluation Board for the TPS2590 Hot Swap Controller. It features a Box package, MSL of 1, and is used for Power Management applications. Ideal for testing and demonstrating the capabilities of the TPS2590 IC in various power management scenarios.

Median Price

$53.900

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13 parts In-Stock

1+ parts

$49.000

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13

$49.000

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DigiKey

USA . 1 parts In-Stock

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$58.800

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1

$58.800

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Distributors (In-Stock)

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Digiode

USA . 1,977 parts In-Stock

1+ parts

$46.550

100+ parts

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1,977

$46.550

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Vyrian

USA . 6,198 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$41.650

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6

$41.650

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Semicontronic

India . 6 parts In-Stock

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$41.650

100+ parts

$40.609

1k+ parts

$40.400

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6

$41.650

$40.609

$40.400

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Corphita

USA . 324 parts In-Stock

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$44.100

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324

$44.100

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Corohmni

South Africa . 166 parts In-Stock

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$49.000

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166

$49.000

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ChromeModa Solutions

Germany . 4,083 parts In-Stock

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4,083

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IDEA Electronic Components Group

UK . 2,320 parts In-Stock

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2,320

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DigiPath Technology Company

USA . 1,884 parts In-Stock

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1,884

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Parana Technologies

USA . 353 parts In-Stock

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$0.683

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353

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$0.683

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Overview

Unlock the power of efficient hot swap control with the TPS2590EVM by Texas Instruments. Designed to deliver top-notch quality and reliability, this evaluation board is perfect for a wide range of applications in power management. Whether you're looking to streamline your development process or enhance your project's performance, the TPS2590EVM offers unparalleled value and benefits. Trust in Texas Instruments' expertise and experience to take your projects to the next level with this innovative solution.

Feature Benefit Bullets

Other Names: 296-31149, TPS2590EVM-ND

Having multiple names makes it easier to identify and search for the product in different catalogs or online platforms.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Being in the category of evaluation boards indicates that this product is specifically designed for testing and evaluating the TPS2590 chip, making it a reliable tool for development purposes.

Package: Box

The box packaging helps in keeping the contents of the kit organized and protected, making it convenient for storage and transportation.

Type: Power Management

Being a power management device, this product is essential for controlling and monitoring the power flow in various electronic applications, ensuring efficient and safe operation.

Function: Hot Swap Controller

The hot swap controller function allows for safe insertion and removal of electronic components while the system is powered on, preventing damage or disruptions, which is crucial for system reliability.

Utilized IC / Part: TPS2590

Designed specifically for the TPS2590 chip, this evaluation board ensures compatibility and optimal performance when testing or utilizing the TPS2590 in power management applications.

Supplied Contents: Board(s)

The inclusion of the board(s) provides a ready-to-use platform for testing and evaluating the TPS2590 chip, simplifying the setup process and facilitating quicker development and validation of power management designs.

Base Product Number: TPS2590

Being the base product number, TPS2590 is a well-known and widely used power management chip, ensuring that this evaluation board is compatible with a popular and proven component.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

The MSL level of 1 (Unlimited) indicates that this product can be safely stored and used in various environments without being affected by moisture, ensuring its reliability and longevity.

Technical Specifications

Additional Parts TPS2590EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31149
TPS2590EVM-ND

Function:

Hot Swap Controller

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TPS2590

Package:

Box

Standard Package:

1

Base Product Number:

TPS2590

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS2590EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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