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TPS25821DSST

Texas Instruments

TPS25821DSST by Texas Instruments

TPS25821DSST by Texas Instruments is a small outline, heat sink IC with 12 terminals. It operates b/w -40 to 125 °C and supports supply voltage range of 4.5-5.5 V. Ideal for automotive applications requiring interface circuitry in compact spaces.

Median Price

$1.296

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 78,937 parts In-Stock

1+ parts

$1.131

100+ parts

$0.870

1k+ parts

$0.458

10k+ parts

-

78,937

$1.131

$0.870

$0.458

-

DigiKey

USA . 773 parts In-Stock

1+ parts

$1.460

100+ parts

$0.857

1k+ parts

$0.758

10k+ parts

$0.700

773

$1.460

$0.857

$0.758

$0.700

Mouser Electronics

USA . 191 parts In-Stock

1+ parts

$1.460

100+ parts

$0.857

1k+ parts

$0.730

10k+ parts

$0.693

191

$1.460

$0.857

$0.730

$0.693

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.603

10k+ parts

$0.544

250

-

-

$0.603

$0.544

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.705

100+ parts

-

1k+ parts

-

10k+ parts

-

900

$0.705

-

-

-

Digiode

USA . 227 parts In-Stock

1+ parts

$1.074

100+ parts

-

1k+ parts

-

10k+ parts

-

227

$1.074

-

-

-

Chip Stock

USA . 383,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

383,500

-

-

-

-

Vyrian

USA . 19,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,895

-

-

-

-

TME

Poland . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.870

10k+ parts

-

500

-

-

$0.870

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 19,605 parts In-Stock

1+ parts

$0.510

100+ parts

-

1k+ parts

-

10k+ parts

-

19,605

$0.510

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$0.691

100+ parts

-

1k+ parts

$0.663

10k+ parts

-

2,000

$0.691

-

$0.663

-

Continental Prestige Electronics

USA . 3,465 parts In-Stock

1+ parts

$0.705

100+ parts

-

1k+ parts

-

10k+ parts

$0.691

3,465

$0.705

-

-

$0.691

Argo Parts USA

USA . 1,026 parts In-Stock

1+ parts

$0.705

100+ parts

-

1k+ parts

-

10k+ parts

$0.684

1,026

$0.705

-

-

$0.684

Corphita

USA . 2,838 parts In-Stock

1+ parts

$1.018

100+ parts

-

1k+ parts

-

10k+ parts

-

2,838

$1.018

-

-

-

Parana Technologies

USA . 1,411 parts In-Stock

1+ parts

$7.804

100+ parts

-

1k+ parts

$8.353

10k+ parts

-

1,411

$7.804

-

$8.353

-

DigiPath Technology Company

USA . 2,188 parts In-Stock

1+ parts

$8.593

100+ parts

$7.905

1k+ parts

-

10k+ parts

-

2,188

$8.593

$7.905

-

-

ChromeModa Solutions

Germany . 3,257 parts In-Stock

1+ parts

$8.768

100+ parts

$7.190

1k+ parts

-

10k+ parts

-

3,257

$8.768

$7.190

-

-

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$8.768

100+ parts

$8.330

1k+ parts

$7.891

10k+ parts

-

1,519

$8.768

$8.330

$7.891

-

Overview

Discover the TPS25821DSST by Texas Instruments, a premium quality interface IC designed for various applications. With Texas Instruments' renowned reputation for excellence in manufacturing, this product offers exceptional value and benefits to customers. Whether you need it for automotive or other functions, this small outline, heat sink package ensures reliable performance in extreme temperatures. Experience the advantages of dual terminal position, nickel palladium gold finish, and more with the TPS25821DSST. Elevate your projects with this innovative solution from Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage capability provides flexibility in power sources, allowing for compatibility with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to handle, making the product suitable for various electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets the stringent requirements for temperature performance and reliability in vehicular environments.

Technical Specifications

Other Function Interface ICs TPS25821DSST attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

TPS25821DSST Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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