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TPS2480EVM-002

Texas Instruments

TPS2480EVM-002 by Texas Instruments

TPS2480EVM-002 by Texas Instruments is a Power Management Evaluation Board for TPS2480 Hot Swap Controller. It comes in a Box package and includes the board(s). MSL level is 1, making it suitable for various applications requiring hot swap control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,708 parts In-Stock

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Digiode

USA . 3,948 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 532 parts In-Stock

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$11.408

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532

$11.408

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One Stop Electronics

USA . 1,188 parts In-Stock

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$26.100

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$26.100

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Semicontronic

India . 633 parts In-Stock

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$80.100

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$78.098

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$77.697

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633

$80.100

$78.098

$77.697

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Ampacity Inc.

Singapore . 748 parts In-Stock

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$126.100

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748

$126.100

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ChromeModa Solutions

Germany . 5,190 parts In-Stock

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Parana Technologies

USA . 2,103 parts In-Stock

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$0.514

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$0.514

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DigiPath Technology Company

USA . 1,956 parts In-Stock

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Corphita

USA . 1,172 parts In-Stock

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IDEA Electronic Components Group

UK . 315 parts In-Stock

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Corohmni

South Africa . 158 parts In-Stock

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Overview

Discover the power of seamless hot swap control with the TPS2480EVM-002 by Texas Instruments. As a trusted name in the industry, Texas Instruments delivers unparalleled quality and reliability. This development board is perfect for evaluating and demonstrating the capabilities of the TPS2480 hot swap controller. Designed for power management applications, this board offers a convenient solution for managing power distribution effortlessly. Unlock the potential of your projects with the TPS2480EVM-002 and experience the benefits of precision engineering and cutting-edge technology.

Feature Benefit Bullets

Other Names: 296-31140, TPS2480EVM-002-ND, TPS2480EVM002

Having multiple names makes it easier to search for and purchase this product from different sources.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Evaluation and Demonstration Boards and Kits

Being categorized as evaluation and demonstration boards shows that this product is designed for testing and showcasing the capabilities of the TPS2480 hot swap controller.

Package: Box

The product comes in a box packaging, providing protection during shipping and storage.

Type: Power Management

Being a power management product, it provides control and protection for power systems, enhancing overall reliability.

Function: Hot Swap Controller

The hot swap controller function allows for safe insertion and removal of components in a powered system, reducing the risk of damage and downtime.

Utilized IC / Part: TPS2480

The product is designed specifically around the TPS2480, ensuring compatibility and optimal performance.

Supplied Contents: Board(s)

The package includes the necessary board(s) for testing and evaluating the TPS2480 hot swap controller.

Base Product Number: TPS2480

This product is based on the TPS2480, indicating its primary function and purpose.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Having an MSL of 1 (Unlimited) means the product can be stored and handled in environment without the need for special precautions related to moisture exposure.

Technical Specifications

Additional Parts TPS2480EVM-002 attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31140
TPS2480EVM-002-ND
TPS2480EVM002

Function:

Hot Swap Controller

Type:

Power Management

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Board(s)

Utilized IC / Part:

TPS2480

Package:

Box

Standard Package:

1

Base Product Number:

TPS2480

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS2480EVM-002 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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