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TPS2413EVM

Texas Instruments

TPS2413EVM by Texas Instruments

TPS2413EVM by Texas Instruments is a Power Management Evaluation Board for ORing Controller / Load Share function. It supports 3V ~ 16.5V Supply with N+1 Power Supplies, making it ideal for testing power management solutions in various applications. The kit includes the TPS2413 IC and is designed for Development Boards, Kits, Programmers to evaluate and demonstrate power supply configurations efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,795 parts In-Stock

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Digiode

USA . 2,857 parts In-Stock

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2,857

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Distributors (Availability)

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AZTECH Wire

Italy . 454 parts In-Stock

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$10.182

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454

$10.182

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Ampacity Inc.

Singapore . 1,442 parts In-Stock

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$14.100

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One Stop Electronics

USA . 704 parts In-Stock

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$69.100

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704

$69.100

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Semicontronic

India . 598 parts In-Stock

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$182.100

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$177.548

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$176.637

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598

$182.100

$177.548

$176.637

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Corphita

USA . 3,755 parts In-Stock

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3,755

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IDEA Electronic Components Group

UK . 2,329 parts In-Stock

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2,329

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ChromeModa Solutions

Germany . 1,646 parts In-Stock

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DigiPath Technology Company

USA . 1,508 parts In-Stock

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Parana Technologies

USA . 1,032 parts In-Stock

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$1.020

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Corohmni

South Africa . 420 parts In-Stock

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Perfect Parts

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Overview

Enhance your power management system with the TPS2413EVM by Texas Instruments. Designed for ORing control and load sharing, this evaluation board offers top-notch quality and reliability that TI is known for. Perfect for N+1 power supply setups, the TPS2413EVM provides seamless integration and superior performance. Upgrade your development projects with ease and confidence using this versatile and efficient tool. Elevate your power management capabilities today with the TPS2413EVM.

Feature Benefit Bullets

Other Names: 296-31133, TPS2413EVM-ND

Makes it easy to identify and search for this specific product.

Category: Development Boards, Kits, Programmers, Evaluation Boards

Provides a wide range of applications for development and evaluation purposes.

Package: Box

Ensures safe and secure packaging of the product during shipping and storage.

Type: Power Management

Helps in efficiently managing power within electronic systems.

Function: ORing Controller / Load Share

Enables seamless power distribution and sharing between multiple power supplies.

Utilized IC / Part: TPS2413

Utilizes a reliable and high-performance Integrated Circuit for power management.

Primary Attributes: N+1 Power Supplies

Supports redundancy and backup in power supply systems for added reliability.

Supplied Contents: Board(s)

Comes with necessary board(s) for easy setup and testing.

Secondary Attributes: 3V ~ 16.5V Supply

Compatible with a wide range of input voltages for versatile applications.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored and used in various environments without being affected by moisture.

Technical Specifications

Additional Parts TPS2413EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-31133
TPS2413EVM-ND

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Standard Package:

1

Function:

ORing Controller / Load Share

Type:

Power Management

Supplied Contents:

Board(s)

Secondary Attributes:

3V ~ 16.5V Supply

Utilized IC / Part:

TPS2413

Package:

Box

Embedded:

No

Primary Attributes:

N+1 Power Supplies

Base Product Number:

TPS2413

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPS2413EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8543.70.9860

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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