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TPS2371DRG4

Texas Instruments

TPS2371DRG4 by Texas Instruments

TPS2371DRG4 by Texas Instruments is a Network Interfaces IC with 8 terminals, operating temp. range of 0-70°C, and supply voltage of 48V. It is used in support circuits for telecom applications due to its CMOS technology and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,692 parts In-Stock

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9,692

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Digiode

USA . 1,580 parts In-Stock

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1,580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 967 parts In-Stock

1+ parts

$5.665

100+ parts

$526.067

1k+ parts

$5.098

10k+ parts

-

967

$5.665

$526.067

$5.098

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DigiPath Technology Company

USA . 35 parts In-Stock

1+ parts

$6.238

100+ parts

$5.739

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35

$6.238

$5.739

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

1+ parts

$6.365

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$5.728

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1,824

$6.365

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$5.728

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ChromeModa Solutions

Germany . 1,399 parts In-Stock

1+ parts

$6.365

100+ parts

$5.219

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1,399

$6.365

$5.219

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AZTECH Wire

Italy . 9,692 parts In-Stock

1+ parts

$7.290

100+ parts

$7.000

1k+ parts

$6.860

10k+ parts

$6.720

9,692

$7.290

$7.000

$6.860

$6.720

One Stop Electronics

USA . 1,374 parts In-Stock

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$349.000

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$349.000

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Corphita

USA . 1,462 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the TPS2371DRG4, a versatile network interface solution that offers unmatched performance in a compact package. Ideal for a wide range of applications, this innovative product delivers exceptional value and benefits to customers looking for seamless connectivity and efficient power management. Trust Texas Instruments for cutting-edge technology and top-notch customer satisfaction, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the network interface, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, making the network interface suitable for a variety of applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this network interface can withstand high temperatures, making it suitable for use in a range of environments.

Nominal Supply Voltage: 48 V

The nominal supply voltage of 48V provides stable and reliable power to the network interface, ensuring consistent performance.

Technology: CMOS

The use of CMOS technology ensures efficient power consumption and high-speed performance, making this network interface a cost-effective and reliable choice.

Technical Specifications

Network Interfaces TPS2371DRG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

48 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TPS2371DRG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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