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TPA3200D1DCPG4

Texas Instruments

TPA3200D1DCPG4 by Texas Instruments

TPA3200D1DCPG4 by Texas Instruments is an audio amplifier with 1% harmonic distortion, 12.8W output power, and 23.6dB gain. It operates b/w -40 to 85°C, suitable for industrial applications requiring high-quality audio amplification in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,181

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Digiode

USA . 2,782 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,782

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,710 parts In-Stock

1+ parts

$0.509

100+ parts

-

1k+ parts

$1.628

10k+ parts

-

1,710

$0.509

-

$1.628

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ChromeModa Solutions

Germany . 4,957 parts In-Stock

1+ parts

$0.572

100+ parts

$0.469

1k+ parts

-

10k+ parts

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4,957

$0.572

$0.469

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IDEA Electronic Components Group

UK . 698 parts In-Stock

1+ parts

$0.572

100+ parts

-

1k+ parts

$0.515

10k+ parts

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698

$0.572

-

$0.515

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One Stop Electronics

USA . 1,364 parts In-Stock

1+ parts

$18.800

100+ parts

-

1k+ parts

-

10k+ parts

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1,364

$18.800

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-

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AZTECH Wire

Italy . 209 parts In-Stock

1+ parts

$19.319

100+ parts

-

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209

$19.319

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Corphita

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

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2,520

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DigiPath Technology Company

USA . 654 parts In-Stock

1+ parts

-

100+ parts

$0.516

1k+ parts

-

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654

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$0.516

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Microchip USA

USA . 103 parts In-Stock

1+ parts

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103

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Overview

Unleash the power of high-quality audio with the TPA3200D1DCPG4 by Texas Instruments. Designed to deliver crisp and clear sound, this audio amplifier is perfect for a wide range of applications in the Audio & Video industry. With its advanced technology and top-notch manufacturing, Texas Instruments ensures reliability and exceptional performance. Whether you're designing a home theater system or working on professional audio equipment, this amplifier offers unmatched value, benefits, and advantages to elevate your audio experience. Upgrade your sound system today with the TPA3200D1DCPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability, making the product ideal for long-term use.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly of the amplifier onto circuit boards, saving space and allowing for high-density layouts.

Harmonic Distortion: 1%

Low harmonic distortion ensures high audio quality with minimal interference or distortion in the output signal.

Nominal Output Power: 12.8 W

The high output power of 12.8W allows the amplifier to drive speakers or headphones with sufficient volume and clarity.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range of -40 to 85 °C ensures the amplifier can withstand harsh operating environments and temperature fluctuations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the amplifier energy-efficient and reliable for audio amplification.

Technical Specifications

Audio & Video Amplifiers TPA3200D1DCPG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 8V TO 18V SUPPLY

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

23.6 dB

Harmonic Distortion:

1 %

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

11.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

12.8 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP44,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

TPA3200D1DCPG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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