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TPA3132D2EVM

Texas Instruments

TPA3132D2EVM by Texas Instruments

TPA3132D2EVM by Texas Instruments is a Class D audio amplifier evaluation board with 2-channel stereo output. It delivers 42W x 2 @ 4Ω and 25W x 2 @ 8Ω max output power. Suitable for developing high-quality audio systems in various applications.

Median Price

$199.200

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17 parts In-Stock

1+ parts

$166.000

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17

$166.000

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DigiKey

USA . 2 parts In-Stock

1+ parts

$199.200

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2

$199.200

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Mouser Electronics

USA . 1 parts In-Stock

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$199.210

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1

$199.210

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Distributors (In-Stock)

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Digiode

USA . 3,624 parts In-Stock

1+ parts

$157.700

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3,624

$157.700

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Vyrian

USA . 6,712 parts In-Stock

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6,712

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 6 parts In-Stock

1+ parts

$141.100

100+ parts

$137.572

1k+ parts

$136.867

10k+ parts

-

6

$141.100

$137.572

$136.867

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Corphita

USA . 1,528 parts In-Stock

1+ parts

$149.400

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1,528

$149.400

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Corohmni

South Africa . 114 parts In-Stock

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$166.000

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114

$166.000

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Ampacity Inc.

Singapore . 6 parts In-Stock

1+ parts

$307.100

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6

$307.100

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ChromeModa Solutions

Germany . 4,102 parts In-Stock

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4,102

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Parana Technologies

USA . 1,728 parts In-Stock

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$0.545

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1,728

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$0.545

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IDEA Electronic Components Group

UK . 402 parts In-Stock

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402

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DigiPath Technology Company

USA . 85 parts In-Stock

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85

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Overview

Experience superior audio quality with the TPA3132D2EVM by Texas Instruments, a leading manufacturer known for their innovative solutions. This development board offers unmatched performance and versatility in the audio amplifier category, making it ideal for a wide range of applications. With its Class D amplifier type and 2-channel output, this EVM provides a maximum output power of 42W x 2 @ 4Ohm, ensuring a powerful and crisp sound experience. Invest in the TPA3132D2EVM today and elevate your audio projects to new heights.

Feature Benefit Bullets

Other Names: 296-37093

Easy to identify and locate in catalogs or online stores.

Category: Development Boards, Kits, Programmers, Evaluation Boards, Audio Amplifier Evaluation Boards

Versatile functionality for development and evaluation purposes.

Package: Box

Provides a safe and organized enclosure for the amplifier components.

Amplifier Type: Class D

Efficient power usage and minimal heat generation.

Output Type: 2-Channel (Stereo)

Allows for stereo sound output.

Max Output Power x Channels @ Load: 42W x 2 @ 4Ohm, 25W x 2 @ 8Ohm

Delivers high-quality audio performance for various speaker configurations.

Voltage - Supply: 4.5V ~ 26V

Wide range of supply voltage options for compatibility with various systems.

Board Type: Fully Populated

Ready for immediate use without additional assembly required.

Utilized IC / Part: TPA3132D2

High-quality integrated circuit for reliable amplifier performance.

Supplied Contents: Board(s)

Includes necessary components for audio amplifier functionality.

Base Product Number: TPA3132

Identifies as part of a specific product line for compatibility and reference.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for a wide range of environmental conditions without risk of damage.

Technical Specifications

Additional Parts TPA3132D2EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

296-37093

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Output Type:

2-Channel (Stereo)

Max Output Power x Channels @ Load:

42W x 2 @ 4Ohm, 25W x 2 @ 8Ohm

Standard Package:

1

Supplied Contents:

Board(s)

Voltage - Supply:

4.5V ~ 26V

Board Type:

Fully Populated

Utilized IC / Part:

TPA3132D2

Package:

Box

Amplifier Type:

Class D

Base Product Number:

TPA3132

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPA3132D2EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8518.40.2000

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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