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TPA3123D2EVM

Texas Instruments

TPA3123D2EVM by Texas Instruments

TPA3123D2EVM by Texas Instruments is an Audio Amplifier Evaluation Board with Class D amplifier type. It offers 25W x 2 output power at 4Ohm load, operating voltage of 10-30V. This fully populated board utilizes TPA3123D2 IC and is ideal for stereo audio amplification applications.

Median Price

$184.800

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25 parts In-Stock

1+ parts

$154.000

100+ parts

-

1k+ parts

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25

$154.000

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-

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DigiKey

USA . 1 parts In-Stock

1+ parts

$184.800

100+ parts

-

1k+ parts

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1

$184.800

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-

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Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$184.810

100+ parts

-

1k+ parts

-

10k+ parts

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2

$184.810

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,056 parts In-Stock

1+ parts

$146.300

100+ parts

-

1k+ parts

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2,056

$146.300

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Vyrian

USA . 7,655 parts In-Stock

1+ parts

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7,655

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$130.900

100+ parts

-

1k+ parts

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10k+ parts

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10

$130.900

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-

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Semicontronic

India . 10 parts In-Stock

1+ parts

$130.900

100+ parts

$127.628

1k+ parts

$126.973

10k+ parts

-

10

$130.900

$127.628

$126.973

-

Corphita

USA . 1,147 parts In-Stock

1+ parts

$138.600

100+ parts

-

1k+ parts

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1,147

$138.600

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Corohmni

South Africa . 343 parts In-Stock

1+ parts

$154.000

100+ parts

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343

$154.000

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ChromeModa Solutions

Germany . 4,525 parts In-Stock

1+ parts

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4,525

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Parana Technologies

USA . 502 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.944

10k+ parts

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502

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$0.944

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DigiPath Technology Company

USA . 400 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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400

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IDEA Electronic Components Group

UK . 119 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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119

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Overview

Experience the unmatched quality and performance of the TPA3123D2EVM by Texas Instruments, a leading manufacturer in the industry. This audio amplifier evaluation board offers exceptional sound clarity and power, making it perfect for a wide range of applications. Whether you're a DIY enthusiast or a professional audio engineer, this fully populated board provides a seamless experience without compromising on quality. Elevate your audio projects with the TPA3123D2EVM and enjoy the benefits of superior sound reproduction and reliable performance.

Feature Benefit Bullets

Amplifier Type: Class D

Class D amplifiers are known for their high efficiency and low heat generation, making this evaluation board energy-efficient and reliable.

Max Output Power x Channels @ Load: 25W x 2 @ 4Ohm

With a maximum output power of 25W per channel at 4 Ohms, this evaluation board can deliver powerful and clear audio to your speakers.

Voltage - Supply: 10V ~ 30V

Wide supply voltage range of 10V to 30V allows flexibility in powering the evaluation board, making it suitable for various applications.

Board Type: Fully Populated

The fully populated board means that all necessary components are already installed, allowing for easy setup and testing of the amplifier circuit.

Utilized IC / Part: TPA3123D2

The TPA3123D2 is a high-performance Class D amplifier IC known for its audio quality and efficiency, ensuring superior sound output from this evaluation board.

Technical Specifications

Additional Parts TPA3123D2EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Supplied Contents:

Board(s)

Output Type:

2-Channel (Stereo)

Voltage - Supply:

10V ~ 30V

Max Output Power x Channels @ Load:

25W x 2 @ 4Ohm

Board Type:

Fully Populated

Utilized IC / Part:

TPA3123D2

Package:

Box

Amplifier Type:

Class D

Standard Package:

1

Base Product Number:

TPA3123

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPA3123D2EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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