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TPA3101D2EVM

Texas Instruments

TPA3101D2EVM by Texas Instruments

TPA3101D2EVM by Texas Instruments is a Class D audio amplifier evaluation board with 2-channel stereo output delivering 10W x 2 @ 8Ω. It operates at a supply voltage of 10V to 26V, making it suitable for various development projects requiring high-quality sound amplification in a compact package. Ideal for applications in the development of audio systems and electronic devices where space efficiency and performance are crucial.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,392 parts In-Stock

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Digiode

USA . 1,883 parts In-Stock

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1,883

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Distributors (Availability)

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AZTECH Wire

Italy . 835 parts In-Stock

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$4.983

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835

$4.983

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Semicontronic

India . 1,599 parts In-Stock

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$50.100

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$48.848

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$48.597

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$50.100

$48.848

$48.597

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One Stop Electronics

USA . 1,089 parts In-Stock

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$148.100

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$148.100

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Ampacity Inc.

Singapore . 318 parts In-Stock

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$169.100

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318

$169.100

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DigiPath Technology Company

USA . 2,369 parts In-Stock

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2,369

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Corphita

USA . 2,276 parts In-Stock

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IDEA Electronic Components Group

UK . 2,255 parts In-Stock

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ChromeModa Solutions

Germany . 1,890 parts In-Stock

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1,890

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Parana Technologies

USA . 976 parts In-Stock

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$1.244

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Corohmni

South Africa . 205 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Experience superior audio quality with the TPA3101D2EVM from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that guarantee reliability and performance. This development board offers a Class D amplifier type with 2-channel stereo output, providing a maximum power of 10W x 2 at 8Ohm. Perfect for audio amplifier evaluation, this board is fully populated and comes with all the necessary components for easy setup. Trust Texas Instruments to provide cutting-edge solutions for your audio needs. Unlock the full potential of your audio projects with the TPA3101D2EVM today!

Feature Benefit Bullets

Other Names

Multiple names make it easily recognizable and accessible for users.

Category

Belongs to multiple categories, offering versatility for different applications.

Package

Well-packaged for protection and easy transportation.

Amplifier Type

Efficient and low heat generation, ideal for various audio applications.

Output Type

Provides stereo output for immersive audio experience.

Max Output Power x Channels @ Load

Delivers sufficient power for dual-channel audio amplification.

Voltage - Supply

Wide range of supply voltage accommodates different power sources.

Board Type

Ready for immediate use without additional components.

Utilized IC / Part

Utilizes a specific IC for optimized performance.

Supplied Contents

Comes with essential boards included for easy setup.

Base Product Number

Identifies the product in a series for compatibility and expansion.

Moisture Sensitivity Level (MSL)

Can be stored and operated in various environments without moisture concerns.

Technical Specifications

Additional Parts TPA3101D2EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-296-21139
296-21139
-296-21139-ND
-TPA3101D2EVM-NDR
296-21139-NDR

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Output Type:

2-Channel (Stereo)

Max Output Power x Channels @ Load:

10W x 2 @ 8Ohm

Standard Package:

1

Supplied Contents:

Board(s)

Voltage - Supply:

10V ~ 26V

Board Type:

Fully Populated

Utilized IC / Part:

TPA3101D2

Package:

Box

Amplifier Type:

Class D

Base Product Number:

TPA310

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPA3101D2EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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