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TPA3100D2EVM

Texas Instruments

TPA3100D2EVM by Texas Instruments

TPA3100D2EVM by Texas Instruments is a Class D audio amplifier evaluation board with 2-channel stereo output delivering 20W x 2 @ 8Ω. It operates at a supply voltage of 10V to 26V, making it suitable for various development projects requiring high-quality sound amplification in a fully populated box package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,990 parts In-Stock

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7,990

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Digiode

USA . 3,850 parts In-Stock

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3,850

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Distributors (Availability)

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AZTECH Wire

Italy . 197 parts In-Stock

1+ parts

$8.273

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197

$8.273

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Ampacity Inc.

Singapore . 172 parts In-Stock

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$10.100

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172

$10.100

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One Stop Electronics

USA . 1,422 parts In-Stock

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$139.100

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1,422

$139.100

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Semicontronic

India . 457 parts In-Stock

1+ parts

$200.100

100+ parts

$195.098

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$194.097

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457

$200.100

$195.098

$194.097

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Corphita

USA . 3,384 parts In-Stock

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3,384

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ChromeModa Solutions

Germany . 3,247 parts In-Stock

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3,247

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IDEA Electronic Components Group

UK . 2,240 parts In-Stock

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2,240

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DigiPath Technology Company

USA . 1,513 parts In-Stock

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1,513

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Corohmni

South Africa . 151 parts In-Stock

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151

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Parana Technologies

USA . 1 parts In-Stock

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$1.196

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1

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$1.196

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Overview

Unleash the power of high-quality audio amplification with the TPA3100D2EVM by Texas Instruments. This top-notch development board is perfect for evaluating audio amplifier performance, offering a Class D design and 2-channel stereo output for crystal-clear sound. Whether you're a professional in the audio industry or an enthusiast looking to enhance your listening experience, this board delivers unmatched value and reliability. Elevate your audio projects with the TPA3100D2EVM and experience the exceptional quality that Texas Instruments is renowned for.

Feature Benefit Bullets

Other Names - TPA3100D2EVM-NDR

This product is easily identifiable with multiple references.

Category - Development Boards, Kits, Programmers Evaluation Boards Audio Amplifier Evaluation Boards

This product is versatile and can be used for development, evaluation, and testing purposes.

Package - Box

The product comes in a protective package, ensuring safe transportation and storage.

Amplifier Type - Class D

Class D amplifiers are known for their efficiency and low heat generation, making this product energy-efficient.

Output Type - 2-Channel (Stereo)

This stereo output capability allows for a more immersive audio experience.

Max Output Power x Channels @ Load - 20W x 2 @ 8Ohm

This high output power ensures a strong and clear sound output.

Voltage - Supply - 10V ~ 26V

Wide voltage supply range provides flexibility in various applications.

Board Type - Fully Populated

The fully populated board comes ready for use, saving time and effort in assembly.

Utilized IC / Part - TPA3100D2

The use of a specific IC/part ensures compatibility and optimized performance.

Supplied Contents - Board(s)

The product includes the necessary board(s) for evaluation and testing.

Base Product Number - TPA310

The base product number helps in easy identification and compatibility with related products.

Moisture Sensitivity Level (MSL) - 1 (Unlimited)

The unlimited moisture sensitivity level ensures the product's reliability in different environmental conditions.

Technical Specifications

Additional Parts TPA3100D2EVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

-TPA3100D2EVM-NDR
-296-21138
-296-21138-ND
296-21138
296-21138-NDR

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Output Type:

2-Channel (Stereo)

Max Output Power x Channels @ Load:

20W x 2 @ 8Ohm

Standard Package:

1

Supplied Contents:

Board(s)

Voltage - Supply:

10V ~ 26V

Board Type:

Fully Populated

Utilized IC / Part:

TPA3100D2

Package:

Box

Amplifier Type:

Class D

Base Product Number:

TPA310

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TPA3100D2EVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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