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TPA3008D2PHPRG4

Texas Instruments

TPA3008D2PHPRG4 by Texas Instruments

TPA3008D2PHPRG4 by Texas Instruments is a 10W audio amplifier IC with 2 channels, operating at -40 to 85°C. It features a gain of 31.8 dB, CMOS technology, and requires a supply voltage of 8.5-18V. Ideal for industrial applications requiring high-quality audio amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,091 parts In-Stock

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7,091

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,989 parts In-Stock

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1,989

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Digiode

USA . 1,534 parts In-Stock

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1,534

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Distributors (Availability)

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Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

$3.243

100+ parts

-

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$3.766

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2,225

$3.243

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$3.766

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ChromeModa Solutions

Germany . 6,517 parts In-Stock

1+ parts

$3.644

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$2.988

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6,517

$3.644

$2.988

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IDEA Electronic Components Group

UK . 1,693 parts In-Stock

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$3.644

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$3.280

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1,693

$3.644

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$3.280

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$4.220

100+ parts

$3.840

1k+ parts

$3.460

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2,000

$4.220

$3.840

$3.460

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One Stop Electronics

USA . 733 parts In-Stock

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$13.800

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733

$13.800

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AZTECH Wire

Italy . 589 parts In-Stock

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$17.605

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589

$17.605

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Corphita

USA . 4,652 parts In-Stock

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4,652

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Kepictronics

USA . 3,332 parts In-Stock

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Microchip USA

USA . 1,726 parts In-Stock

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1,726

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DigiPath Technology Company

USA . 836 parts In-Stock

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$3.285

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836

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$3.285

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Overview

Elevate your audio experience with the TPA3008D2PHPRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Audio & Video Amplifiers that are perfect for a wide range of applications. This versatile amplifier offers 10W of nominal output power and a gain of 31.8dB, ensuring crystal clear sound reproduction. With a compact design and high reliability, this amplifier is a must-have for any audio enthusiast. Upgrade your audio system today with the TPA3008D2PHPRG4 and enjoy unparalleled performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the amplifier easy to handle and long-lasting.

Surface Mount: YES

Allows for easy installation and integration with other electronic components.

Nominal Output Power: 10 W

Provides a decent power output for audio amplification, suitable for various applications.

Maximum Operating Temperature: 85 °C

Ensures stable performance even in high temperature environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the amplifier.

Technical Specifications

Audio & Video Amplifiers TPA3008D2PHPRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

31.8 dB

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

4

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

10 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

22 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TPA3008D2PHPRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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