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TPA0253DGQG4

Texas Instruments

TPA0253DGQG4 by Texas Instruments

TPA0253DGQG4 by Texas Instruments is an audio amplifier IC with 1W output power, 8dB gain, and 0.1% harmonic distortion. It operates in industrial temperature range (-40 to 85°C) with a supply voltage of 2.5-5.5V. Suitable for compact audio applications due to its small outline package and low noise figure of 93dB.

Median Price

$4.420

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 399 parts In-Stock

1+ parts

$4.420

100+ parts

$2.260

1k+ parts

$1.530

10k+ parts

$1.460

399

$4.420

$2.260

$1.530

$1.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,241 parts In-Stock

1+ parts

$2.527

100+ parts

-

1k+ parts

-

10k+ parts

-

4,241

$2.527

-

-

-

Vyrian

USA . 8,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,086

-

-

-

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Euro-Tech

UK . 355 parts In-Stock

1+ parts

-

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1k+ parts

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355

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

$0.668

100+ parts

-

1k+ parts

$1.717

10k+ parts

-

2,004

$0.668

-

$1.717

-

DigiPath Technology Company

USA . 1,467 parts In-Stock

1+ parts

$0.735

100+ parts

-

1k+ parts

-

10k+ parts

-

1,467

$0.735

-

-

-

ChromeModa Solutions

Germany . 3,012 parts In-Stock

1+ parts

$0.750

100+ parts

$0.615

1k+ parts

-

10k+ parts

-

3,012

$0.750

$0.615

-

-

IDEA Electronic Components Group

UK . 1,512 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

$0.675

10k+ parts

-

1,512

$0.750

-

$0.675

-

Corphita

USA . 2,521 parts In-Stock

1+ parts

$2.394

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

$2.394

-

-

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A-Z Elektronik GmbH

Germany . 7,005 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,005

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Microchip USA

USA . 1,559 parts In-Stock

1+ parts

-

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1,559

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Perfect Parts

USA . 681 parts In-Stock

1+ parts

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681

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Kepictronics

USA . 570 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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570

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Overview

Unleash the power of cutting-edge audio technology with the TPA0253DGQG4 by Texas Instruments. This small outline, heat sink package offers crystal-clear sound quality with minimal distortion, making it the perfect choice for a wide range of audio applications. Whether you're designing portable speakers, headphones, or other audio devices, this industrial-grade amplifier provides unmatched performance and reliability. Elevate your audio experience today with the TPA0253DGQG4 and let your creativity shine through in every note.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the product, making it suitable for long-term use.

Surface Mount: YES

Allows for easy installation and integration into various electronic devices.

Harmonic Distortion: 0.1%

Low distortion ensures high-quality audio output with minimal interference or noise.

Nominal Output Power: 1 W

Sufficient power output for various audio applications, ensuring clear and loud sound.

Nominal Noise Figure: 93 dB

High signal-to-noise ratio for clear audio playback, even in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption and efficient operation for extended battery life.

Technical Specifications

Audio & Video Amplifiers TPA0253DGQG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

8 dB

Harmonic Distortion:

.1 %

JESD-30 Code:

S-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Nominal Noise Figure:

93 dB

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

1 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.19,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

4.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA0253DGQG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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