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TMS370C758ANMT

Texas Instruments

TMS370C758ANMT by Texas Instruments

TMS370C758ANMT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at max 20 MHz. It features 1024 bytes of RAM, OTPROM ROM programmability, and ADC channels. Widely used in industrial applications for its 5V supply voltage and -40 to 105°C temperature range.

Median Price

$28.328

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$25.180

1k+ parts

$22.530

10k+ parts

$21.200

46

-

$25.180

$22.530

$21.200

DigiKey

USA . 46 parts In-Stock

1+ parts

-

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-

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46

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Verical

USA . 46 parts In-Stock

1+ parts

-

100+ parts

$31.475

1k+ parts

$28.163

10k+ parts

$26.500

46

-

$31.475

$28.163

$26.500

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,745 parts In-Stock

1+ parts

$26.572

100+ parts

-

1k+ parts

-

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3,745

$26.572

-

-

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Vyrian

USA . 8,311 parts In-Stock

1+ parts

-

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8,311

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DigiKey Marketplace

USA . 46 parts In-Stock

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46

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,685 parts In-Stock

1+ parts

$25.173

100+ parts

-

1k+ parts

-

10k+ parts

-

2,685

$25.173

-

-

-

Parana Technologies

USA . 1,354 parts In-Stock

1+ parts

$42.586

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$42.586

-

-

-

DigiPath Technology Company

USA . 93 parts In-Stock

1+ parts

$46.893

100+ parts

$43.142

1k+ parts

-

10k+ parts

-

93

$46.893

$43.142

-

-

ChromeModa Solutions

Germany . 5,888 parts In-Stock

1+ parts

$47.850

100+ parts

$39.237

1k+ parts

-

10k+ parts

-

5,888

$47.850

$39.237

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IDEA Electronic Components Group

UK . 2,304 parts In-Stock

1+ parts

$47.850

100+ parts

$45.458

1k+ parts

$43.065

10k+ parts

-

2,304

$47.850

$45.458

$43.065

-

Microchip USA

USA . 2,383 parts In-Stock

1+ parts

$61.760

100+ parts

$60.680

1k+ parts

$60.140

10k+ parts

$59.610

2,383

$61.760

$60.680

$60.140

$59.610

Kepictronics

USA . 46 parts In-Stock

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46

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Assy Fe

Spain . 40 parts In-Stock

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40

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Overview

Unlock the power of cutting-edge technology with the TMS370C758ANMT microcontroller by Texas Instruments. Crafted with precision and expertise, this innovative device is designed to revolutionize the world of electronics. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and reliability. Experience seamless functionality and efficiency with the TMS370C758ANMT, providing you with the tools you need to succeed in today's fast-paced digital landscape. Elevate your projects to new heights and unleash your creativity with this top-of-the-line product from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

Allows for a higher input voltage range, providing flexibility in power supply options.

Address Bus Width: 16

Wide address bus width allows for efficient memory addressing and data transfer.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and allows for easy integration into circuit designs.

Bit Size: 8

8-bit architecture is suitable for many applications and provides a good balance between performance and cost.

Power Supplies (V): 5

Standard voltage supply that is commonly available, ensuring compatibility with existing power sources.

No. of Terminals: 64

Sufficient number of terminals for connecting peripherals and external components, offering flexibility in design.

Package Style (Meter): IN-LINE, SHRINK PITCH

Compact package style with a shrink pitch design saves space on the circuit board and enhances overall aesthetics.

Minimum Supply Voltage: 4.5 V

Allows for operation at lower voltages, enabling energy-efficient and versatile applications.

Maximum Operating Temperature: 105 °C

Allows for operation in high-temperature environments, increasing the range of potential use cases.

CPU Family: TMS370

Part of a well-known and reliable CPU family, ensuring compatibility and availability of resources for development.

Minimum Operating Temperature: -40 °C

Capable of functioning in extremely low temperatures, suitable for various industrial and outdoor applications.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, ensuring reliable connections with other components.

ADC Channels: YES

Integrated analog-to-digital converter (ADC) allows for reading analog sensors and signals, expanding functionality.

Terminal Position: DUAL

Dual terminal position provides a stable connection and ease of assembly in different orientations.

ROM Words: 32768

Large ROM capacity allows for storing firmware, programs, and data, supporting complex applications.

Maximum Seated Height: 5.64 mm

Low profile design with maximum seated height enables the microcontroller to be used in compact and slim devices.

Width: 15.24 mm

Compact width size facilitates easy placement on the circuit board and allows for efficient use of space.

External Data Bus Width: 8

Sufficient data bus width for interfacing with external devices and peripherals, facilitating data transfer.

Maximum Clock Frequency: 20 MHz

High clock frequency supports fast data processing and execution of instructions, enhancing overall performance.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with the ability to withstand harsh environmental conditions and extended operation.

Peripheral IC Type: MICROCONTROLLER

Dedicated microcontroller with integrated peripherals simplifies system design and reduces the need for additional components.

RAM Bytes: 1024

Adequate RAM capacity for temporary data storage and execution of programs, ensuring smooth operation of the device.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mechanical connection and solder joints for reliable electrical connections.

Maximum Supply Current: 56 mA

Low supply current consumption helps in reducing power usage and extending battery life in portable applications.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of analog components, such as motors and LED brightness.

ROM Programmability: OTPROM

One-time programmable ROM offers secure storage of critical data and firmware, preventing unauthorized access or modification.

Terminal Pitch: 1.778 mm

Optimal terminal pitch spacing for easy soldering and assembly, reducing the risk of short circuits or solder bridges.

Speed: 5 rpm

Capable of operating at a speed of 5 revolutions per minute, suitable for controlling slow-moving mechanical systems or processes.

No. of I/O Lines: 53

Sufficient number of input/output lines for connecting to external devices, sensors, and peripherals, enabling versatile functionality.

Technical Specifications

Microcontrollers TMS370C758ANMT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

R-PDIP-T64

JESD-609 Code:

e0

No. of I/O Lines:

53

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP64,.75

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

5.64 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

56 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.778 mm

Terminal Position:

DUAL

Width:

15.24 mm

Peripheral IC Type:

Trade Compliance

TMS370C758ANMT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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