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TMS370C736AFNT

Texas Instruments

TMS370C736AFNT by Texas Instruments

TMS370C736AFNT by Texas Instruments is an 8-bit microcontroller with 44 terminals, operating at a max frequency of 20 MHz. Ideal for industrial applications, it features OTPROM ROM programmability, 512 bytes of RAM, and ADC channels for precise data acquisition.

Median Price

$18.563

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 561 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.290

10k+ parts

$12.500

561

-

$14.850

$13.290

$12.500

DigiKey

USA . 561 parts In-Stock

1+ parts

-

100+ parts

$19.540

1k+ parts

-

10k+ parts

-

561

-

$19.540

-

-

Verical

USA . 212 parts In-Stock

1+ parts

-

100+ parts

$18.563

1k+ parts

$16.613

10k+ parts

$15.625

212

-

$18.563

$16.613

$15.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,742 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

-

10k+ parts

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4,742

$15.675

-

-

-

Vyrian

USA . 4,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,489

-

-

-

-

Rebound Electronics

UK . 1,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,591

-

-

-

-

DigiKey Marketplace

USA . 561 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

561

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,706 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,706

$14.850

-

-

-

Component Stockers USA

USA . 771 parts In-Stock

1+ parts

$16.790

100+ parts

$15.780

1k+ parts

-

10k+ parts

-

771

$16.790

$15.780

-

-

Microchip USA

USA . 357 parts In-Stock

1+ parts

$48.050

100+ parts

$47.360

1k+ parts

$47.020

10k+ parts

$46.680

357

$48.050

$47.360

$47.020

$46.680

Parana Technologies

USA . 1,201 parts In-Stock

1+ parts

$58.889

100+ parts

-

1k+ parts

-

10k+ parts

-

1,201

$58.889

-

-

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DigiPath Technology Company

USA . 1,352 parts In-Stock

1+ parts

$64.844

100+ parts

$59.656

1k+ parts

-

10k+ parts

-

1,352

$64.844

$59.656

-

-

ChromeModa Solutions

Germany . 4,509 parts In-Stock

1+ parts

$66.167

100+ parts

$54.257

1k+ parts

-

10k+ parts

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4,509

$66.167

$54.257

-

-

IDEA Electronic Components Group

UK . 1,123 parts In-Stock

1+ parts

$66.167

100+ parts

$62.859

1k+ parts

$59.550

10k+ parts

-

1,123

$66.167

$62.859

$59.550

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Kepictronics

USA . 3,800 parts In-Stock

1+ parts

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3,800

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Assy Fe

Spain . 6 parts In-Stock

1+ parts

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6

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Overview

Experience top-notch quality with the TMS370C736AFNT microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled reliability and performance. This microcontroller is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to enhance your industrial processes or develop innovative solutions, the TMS370C736AFNT provides the power and efficiency you need to succeed. Elevate your projects with this cutting-edge microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

Square shape allows for efficient use of space on circuit boards and facilitates uniform placement during assembly.

Bit Size: 8

8-bit architecture is suitable for a wide range of simple to moderately complex applications, offering a balance between performance and cost.

Power Supplies (V): 5

Standard voltage supply simplifies integration and compatibility with existing systems.

No. of Terminals: 44

Sufficient number of terminals for connecting peripherals and external components, enabling versatile applications.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging offers a compact and space-saving form factor, ideal for small electronic devices.

Minimum Supply Voltage: 4.5 V

Wide range of supply voltage tolerance allows for operation in varying conditions without compromising performance.

Maximum Operating Temperature: 105 °C

Capable of operating in high-temperature environments, suitable for industrial applications.

CPU Family: TMS370

Part of a reputable CPU family known for reliability and performance, ensuring quality in the microcontroller.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions, expanding the range of environments where the microcontroller can be used.

ADC Channels: YES

Integrated Analog-to-Digital Converter channels enable sensing and measurement capabilities, enhancing functionality.

Terminal Position: QUAD

Quad terminal positioning simplifies connections and layout design, improving ease of use and assembly.

ROM Words: 16384

Ample ROM capacity for storing program instructions and data, suitable for a variety of applications.

Maximum Seated Height: 4.57 mm

Low-profile design with limited seated height allows for compact device construction and space-constrained installations.

Width: 16.585 mm

Compact width dimensions facilitate efficient board layout and integration into electronic systems.

Maximum Clock Frequency: 20 MHz

High clock frequency capability enables fast processing and execution of instructions, suitable for demanding tasks.

Length: 16.585 mm

Balanced length dimensions complement the overall compact form factor, aiding in space optimization.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Peripheral IC Type: MICROCONTROLLER

Microcontroller integration offers versatility and functionality for a wide range of electronic applications.

RAM Bytes: 512

Adequate RAM capacity for data storage and processing, supporting multitasking and data-intensive operations.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology provides low power consumption and high noise immunity, enhancing efficiency.

Terminal Form: J BEND

J bend terminal form offers secure and reliable connections, reducing the risk of disconnections and signal interferences.

Maximum Supply Current: 45 mA

Low supply current requirement minimizes power consumption, ideal for energy-efficient designs.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources and electronic systems.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of output signals, suitable for motor control and analog applications.

ROM Programmability: OTPROM

One-Time Programmable ROM technology ensures secure and permanent storage of critical data and firmware.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for high-density mounting and efficient use of board space.

Speed: 5 rpm

Supports low-speed operation for applications requiring precise timing and control, such as motor control and instrumentation.

No. of I/O Lines: 25

Adequate number of Input/Output lines for interfacing with external devices, sensors, and peripherals, enhancing connectivity and functionality.

Technical Specifications

Microcontrollers TMS370C736AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

No. of I/O Lines:

25

No. of Terminals:

44

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

TMS370C736AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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