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TMS370C732AFNT

Texas Instruments

TMS370C732AFNT by Texas Instruments

TMS370C732AFNT by Texas Instruments is an 8-bit microcontroller with 5V supply, 20MHz clock speed, and 256 bytes of RAM. Widely used in industrial applications for its OTPROM ROM programmability, ADC channels, and PWM support. Package style: CHIP CARRIER, Terminal pitch: 1.27mm, Temperature range: -40 to 105°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,942 parts In-Stock

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Digiode

USA . 826 parts In-Stock

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826

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Distributors (Availability)

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AZTECH Wire

Italy . 490 parts In-Stock

1+ parts

$8.454

100+ parts

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490

$8.454

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One Stop Electronics

USA . 1,377 parts In-Stock

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$34.000

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1,377

$34.000

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Parana Technologies

USA . 748 parts In-Stock

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$40.370

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748

$40.370

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DigiPath Technology Company

USA . 1,780 parts In-Stock

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$44.453

100+ parts

$40.897

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1,780

$44.453

$40.897

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ChromeModa Solutions

Germany . 5,637 parts In-Stock

1+ parts

$45.360

100+ parts

$37.195

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5,637

$45.360

$37.195

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IDEA Electronic Components Group

UK . 317 parts In-Stock

1+ parts

$45.360

100+ parts

$43.092

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$40.824

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317

$45.360

$43.092

$40.824

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Corphita

USA . 3,757 parts In-Stock

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Microchip USA

USA . 113 parts In-Stock

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113

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Overview

Discover the innovative TMS370C732AFNT microcontroller by Texas Instruments, setting the standard for quality and reliability in the industry. With its cutting-edge technology and versatile applications, this chip carrier package offers a wide range of benefits, including high performance, low power consumption, and easy integration. Whether you're designing automotive systems, consumer electronics, or industrial equipment, this microcontroller delivers exceptional value and efficiency, making it the ideal choice for your next project. Unleash the full potential of your designs with the TMS370C732AFNT from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components, making the product suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, offering flexibility in power requirements.

Bit Size: 8

8-bit architecture provides sufficient processing power for a variety of applications.

Power Supplies (V): 5

Standard 5V power supply compatibility simplifies integration with existing systems.

No. of Terminals: 44

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers compact size and efficient heat dissipation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in extreme conditions.

RAM Bytes: 256

256 bytes of RAM provide enough memory for data storage and processing.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast execution of instructions and efficient operation.

Technical Specifications

Microcontrollers TMS370C732AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

No. of I/O Lines:

14

No. of Terminals:

44

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

256

ROM Words:

8192

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

TMS370C732AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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