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TMS370C256AFNT

Texas Instruments

TMS370C256AFNT by Texas Instruments

TMS370C256AFNT by Texas Instruments is an 8-bit microcontroller with 16-bit address bus, operating at max 20 MHz. Suitable for industrial applications, it features OTPROM ROM programmability, 512 bytes of RAM, and ADC channels for data acquisition.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,439 parts In-Stock

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Digiode

USA . 719 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 4 parts In-Stock

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Parana Technologies

USA . 788 parts In-Stock

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$17.589

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$17.782

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AZTECH Wire

Italy . 514 parts In-Stock

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$19.255

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ChromeModa Solutions

Germany . 1,299 parts In-Stock

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$19.763

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IDEA Electronic Components Group

UK . 861 parts In-Stock

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$18.775

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$17.787

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861

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One Stop Electronics

USA . 1,445 parts In-Stock

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$31.000

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DigiPath Technology Company

USA . 1,576 parts In-Stock

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Corphita

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Microchip USA

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your projects with the TMS370C256AFNT by Texas Instruments, a top-tier microcontroller that delivers exceptional performance and reliability. Designed by a trusted industry leader, this versatile chip is perfect for a wide range of applications. With its advanced features and cutting-edge technology, the TMS370C256AFNT offers unmatched value and benefits to customers looking to take their designs to the next level. Trust in Texas Instruments to provide you with the quality and innovation you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient mounting onto circuit boards, saving time in the assembly process.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, increasing compatibility with various power sources.

Address Bus Width: 16

Larger address bus width allows for more memory addressing capability, accommodating more complex programs.

Package Shape: SQUARE

Square shape is convenient for space-saving designs and efficient use of PCB real estate.

Bit Size: 8

Suitable for handling basic computing tasks and applications that do not require high processing power.

Power Supplies (V): 5

Standard voltage supply for compatibility with common power sources.

No. of Terminals: 68

Sufficient number of terminals for connectivity with external components and peripherals.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and suitable for high-density PCB designs.

Minimum Supply Voltage: 4.5 V

Wide range of supply voltage tolerance for flexibility in power supply options.

Maximum Operating Temperature: 105 °C

Can operate at higher temperatures, suitable for industrial applications with elevated heat levels.

CPU Family: TMS370

Part of the TMS370 CPU family known for reliable and efficient performance in embedded systems.

Minimum Operating Temperature: -40 °C

Capable of functioning in freezing temperatures, ideal for harsh environments.

ADC Channels: YES

Integration of Analog-to-Digital Converter (ADC) channels for converting analog signals to digital data.

Terminal Position: QUAD

Quad terminal position for easy and secure connection with external components.

Maximum Seated Height: 4.57 mm

Low profile design for space-constrained applications.

Width: 24.23 mm

Compact width for fitting into tight spaces on the PCB.

External Data Bus Width: 8

Sufficient data bus width for transferring data between the microcontroller and external devices.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing speed and real-time operation.

Length: 24.23 mm

Compact length for space-efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for microcontroller applications, ensuring optimized performance.

RAM Bytes: 512

Sufficient RAM capacity for storing program instructions and data during operation.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: J BEND

J bend terminal form for secure and reliable solder connections.

Maximum Supply Current: 56 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance.

PWM Channels: YES

Pulse Width Modulation (PWM) channels for precise control of analog signals.

ROM Programmability: OTPROM

One-Time Programmable Read-Only Memory (OTPROM) for secure and permanent program storage.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with commonly used connectors.

Speed: 5 rpm

Operates at a speed of 5 revolutions per minute, suitable for slow-speed applications.

No. of I/O Lines: 55

Sufficient number of Input/Output (I/O) lines for connecting with external devices and peripherals.

Technical Specifications

Microcontrollers TMS370C256AFNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

8

CPU Family:

TMS370

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

Length:

24.23 mm

No. of I/O Lines:

55

No. of Terminals:

68

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

56 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

TMS370C256AFNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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