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TMS320F28379SPZPS

Texas Instruments

TMS320F28379SPZPS by Texas Instruments

TMS320F28379SPZPS by Texas Instruments is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 14-Ch 12-Bit ADC. It operates at up to 100 MHz, has 6 DMA channels, and supports CAN, I2C, SPI, UART, USB connectivity. Ideal for automotive applications due to its wide temperature range (-40 to 125 °C) and flash ROM programmability.

Median Price

$15.897

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,242 parts In-Stock

1+ parts

$15.897

100+ parts

$14.130

1k+ parts

$10.390

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3,242

$15.897

$14.130

$10.390

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$14.671

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10

$14.671

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Digiode

USA . 3,381 parts In-Stock

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$15.102

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Vyrian

USA . 1,984 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 332 parts In-Stock

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$11.090

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332

$11.090

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Ampacity Inc.

Singapore . 3,213 parts In-Stock

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$13.510

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Semicontronic

India . 3,194 parts In-Stock

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$13.510

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$13.172

1k+ parts

$13.105

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$13.510

$13.172

$13.105

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Corphita

USA . 4,926 parts In-Stock

1+ parts

$14.307

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Continental Prestige Electronics

USA . 3,621 parts In-Stock

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$14.671

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$14.377

3,621

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$14.377

Netroflash

USA . 500 parts In-Stock

1+ parts

$14.671

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$13.937

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$13.644

500

$14.671

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$13.937

$13.644

Parana Technologies

USA . 505 parts In-Stock

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$17.017

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$17.240

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505

$17.017

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DigiPath Technology Company

USA . 570 parts In-Stock

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$18.738

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570

$18.738

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ChromeModa Solutions

Germany . 5,282 parts In-Stock

1+ parts

$19.120

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$15.678

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$19.120

$15.678

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IDEA Electronic Components Group

UK . 2,048 parts In-Stock

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$19.120

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$18.164

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$17.208

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2,048

$19.120

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$22.103

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$20.998

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$20.998

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500

$22.103

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$20.998

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Corohmni

South Africa . 214 parts In-Stock

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$79.805

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Component Stockers USA

USA . 326 parts In-Stock

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$281.100

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Lixinc

USA . 13,721 parts In-Stock

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Argo Parts USA

USA . 4,156 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TMS320F28379SPZPS by Texas Instruments, a high-quality microcontroller designed to revolutionize your projects. With Texas Instruments' reputation for excellence in manufacturing, this versatile device delivers unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller offers customers a seamless experience, providing value, benefits, and advantages that will elevate your work to new heights. Trust Texas Instruments to take your projects to the next level with the TMS320F28379SPZPS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and convenient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.26 V

Operates efficiently within this voltage range, ensuring stable performance.

Address Bus Width: 8

Provides sufficient addressing capability for handling data and memory management tasks effectively.

Package Shape: SQUARE

Square shape allows for easier handling and placement during assembly processes.

Bit Size: 32

Offers a high processing capability and can handle complex algorithms and computations efficiently.

DAC Channels: YES

Integrated DAC channels allow for analog signal output, enhancing the microcontroller's versatility in controlling external devices.

No. of Terminals: 100

Sufficient terminals for connecting various external components and peripherals, enabling flexible system design.

Minimum Supply Voltage: 1.14 V

Supports low power operation and extends battery life in battery-powered applications.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, making it suitable for demanding industrial and automotive environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, expanding its usability in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and ensures reliable electrical connections for long-term performance.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to accurately read analog signals, enhancing its sensor interfacing capabilities.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, reducing CPU overhead and improving system performance.

Terminal Position: QUAD

Quad terminal positioning allows for easy soldering and reliable connections during assembly.

ROM Words: 1048576

Large ROM capacity for storing program code and data, accommodating complex applications.

Maximum Seated Height: 1.2 mm

Low seated height allows for compact designs and space-constrained applications.

Digital To Analog Converters: 3-Ch 12-Bit

Multiple DAC channels with 12-bit resolution provide precise analog output control for various applications.

Width: 14 mm

Compact width size for space-efficient PCB layout and assembly.

External Data Bus Width: 16

Wide data bus width facilitates fast data transfer and processing capabilities.

Peripherals: DMA(6), PWM(24)

Abundance of DMA and PWM channels offer versatile peripheral interfacing options for diverse system requirements.

Maximum Clock Frequency: 100 MHz

High clock frequency allows for fast processing speeds, suitable for real-time applications and tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robust solder joints and reliability in manufacturing.

Length: 14 mm

Compact length size for space-efficient PCB layout and assembly.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for reliable performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient processing capabilities and optimized performance for embedded applications.

RAM Bytes: 167936

Generous RAM capacity for data storage and manipulation, supporting multitasking and complex computations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections and facilitates automated assembly processes.

Analog To Digital Converters: 14-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate analog signal processing and interfacing.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent performance and power efficiency in various applications.

No. of DMA Channels: 6

Adequate DMA channels for efficient data transfer and memory management tasks, enhancing system performance.

PWM Channels: YES

Integrated PWM channels provide precise control over output signals, suitable for motor control and power regulation.

Connectivity: CAN(2), I2C(2), SPI(3), UART(4), USB

Offers a wide range of connectivity options for interfacing with various devices and peripherals, ensuring compatibility and flexibility.

ROM Programmability: FLASH

Flash ROM allows for easy programming and reprogramming of firmware, facilitating software updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density PCB designs and precise soldering for compact and reliable connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 200 rpm

High processing speed of 200 rpm for rapid data calculations and response times in real-time applications.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits for efficient program storage and execution.

No. of I/O Lines: 41

Sufficient I/O lines for interfacing with external devices and sensors, enabling versatile system connectivity and control.

Technical Specifications

Microcontrollers TMS320F28379SPZPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

HAVING 7-CH ADC IN 16-BIT MODE

Address Bus Width:

8

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

41

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

167936

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), UART(4), USB

Peripherals:

DMA(6), PWM(24)

Analog To Digital Convertors:

14-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28379SPZPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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