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TMS320F28378SPTPS

Texas Instruments

TMS320F28378SPTPS by Texas Instruments

TMS320F28378SPTPS by Texas Instruments is a 32-bit microcontroller with 20-Ch 12-Bit ADC and 3-Ch 12-Bit DAC. It operates at a max frequency of 100 MHz, suitable for automotive applications. With CAN, I2C, SCI, SPI, and USB connectivity options, it offers versatile peripheral support.

Median Price

$25.602

Lifecycle Status

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7

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1k+

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Texas Instruments

USA . 590 parts In-Stock

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$18.575

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$16.226

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$11.190

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590

$18.575

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$11.190

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Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$32.630

100+ parts

$20.760

1k+ parts

$20.750

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9

$32.630

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$20.750

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Digiode

USA . 1,270 parts In-Stock

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$17.646

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1,270

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Nova Conductors

Japan . 150 parts In-Stock

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$20.674

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$20.674

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Vyrian

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Chip Stock

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TME

Poland . 40 parts In-Stock

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$18.770

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40

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Ampacity Inc.

Singapore . 300 parts In-Stock

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$15.790

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$15.790

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Corphita

USA . 110 parts In-Stock

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$16.718

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AZTECH Wire

Italy . 219 parts In-Stock

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$17.855

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Continental Prestige Electronics

USA . 6,065 parts In-Stock

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Netroflash

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Parana Technologies

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IDEA Electronic Components Group

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$21.900

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ChromeModa Solutions

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$19.953

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Advanced Electronics

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$56.714

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$51.610

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$46.505

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$46.505

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Argo Parts USA

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DigiPath Technology Company

USA . 580 parts In-Stock

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$21.939

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$21.939

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Overview

Unlock a world of possibilities with the TMS320F28378SPTPS by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are ideal for a wide range of applications. This powerful microcontroller boasts advanced features such as multiple DAC and ADC channels, DMA capabilities, and an extensive array of peripherals. With its high clock frequency and automotive-grade temperature rating, this microcontroller provides unparalleled performance and reliability. Elevate your projects with the TMS320F28378SPTPS and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product highly resistant to damage.

Surface Mount: YES

The surface mount feature allows for easy and secure installation on a PCB, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The high maximum supply voltage ensures stable performance under various operating conditions.

Address Bus Width: 21

The wide address bus width allows for efficient data transfer and processing, enhancing overall speed and performance.

Package Shape: SQUARE

The square package shape offers a compact design, maximizing space efficiency on the circuit board.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle complex calculations and operations with precision.

DAC Channels: YES

The presence of DAC channels enables accurate analog signal conversion, cater to a wider range of applications.

No. of Terminals: 176

With a high number of terminals, this microcontroller can accommodate various connections and peripherals, expanding its functionality.

Package Style: FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

The multiple package styles offer flexibility in design and installation options, catering to diverse project requirements.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures energy efficiency and reliable operation in low-power applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows the microcontroller to function reliably in harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures the microcontroller can withstand extreme cold conditions without malfunctioning.

Terminal Finish: NICKEL PALLADIUM GOLD

The advanced terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

The availability of ADC channels allows for accurate analog-to-digital conversion, expanding the range of sensors and devices that can be interfaced.

DMA Channels: YES

The presence of DMA channels enhances data transfer speed and efficiency, improving overall system performance.

Terminal Position: QUAD

The quad terminal position offers secure connectivity and easy integration into a circuit layout.

ROM Words: 524288

The large ROM capacity provides ample storage for program instructions, data, and configuration settings.

Maximum Seated Height: 1.6 mm

The low seated height enables compact PCB design and facilitates space-saving in electronic devices.

Digital To Analog Convertors: 3-Ch 12-Bit

The multiple DAC channels with 12-bit resolution ensure precise analog signal generation for diverse applications.

Width: 24 mm

The compact width dimension allows for efficient space utilization on the circuit board.

External Data Bus Width: 32

With a wide data bus width, the microcontroller can handle large amounts of data simultaneously, enhancing processing speed.

Peripherals: DMA(6), PWM(24), TEMPERATURE SENSOR, TIMER(3), WDT(2)

The range of peripherals provides flexibility for interfacing with various devices and sensors, enhancing the microcontroller's versatility.

Maximum Clock Frequency: 100 MHz

The high clock frequency enables fast data processing and real-time response, making the microcontroller suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature streamlines the manufacturing process and reduces production time.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering and robust connections during assembly.

Length: 24 mm

The compact length dimension helps in accommodating the microcontroller within tight spaces in electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the microcontroller can withstand wide temperature fluctuations commonly encountered in automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The high-performance RISC microcontroller architecture offers efficient data processing and power consumption, making it ideal for a wide range of applications.

RAM Bytes: 167936

The ample RAM capacity provides sufficient memory for data storage and processing, enabling multitasking and complex computations.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast operation, enhancing the efficiency and performance of the microcontroller.

Terminal Form: GULL WING

The gull wing terminal form allows for secure soldering connections and reliable electrical contact on the PCB.

Analog To Digital Convertors: 20-Ch 12-Bit

The multiple ADC channels with 12-bit resolution ensure accurate conversion of analog signals from various sensors and devices.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent performance and reliable operation in different environments.

No. of DMA Channels: 6

The multiple DMA channels facilitate high-speed data transfer and efficient communication between peripherals, enhancing overall system performance.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog devices and components, making it suitable for motor control applications.

Connectivity: CAN(2), I2C(2), SCI(4), SPI(3), USB

The multiple connectivity options enable seamless communication with a wide range of devices and peripherals, enhancing the microcontroller's applicability in various systems.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and system enhancements.

Terminal Pitch: 0.5 mm

The fine terminal pitch enables high-density integration on the PCB, saving space and allowing for complex designs.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the microcontroller's resistance to moisture-induced damage, ensuring reliability in humid environments.

Speed: 200 rpm

The high-speed performance of the microcontroller enables rapid data processing and response, making it suitable for time-critical applications.

On Chip Program ROM Width: 16

The wide on-chip ROM width accommodates a large number of program instructions, enabling complex algorithms and functions to be executed efficiently.

No. of I/O Lines: 97

The high number of I/O lines allows for versatile connectivity with external devices and peripherals, expanding the microcontroller's interfacing capabilities.

Technical Specifications

Microcontrollers TMS320F28378SPTPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

21

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

97

No. of Terminals:

176

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

167936

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), SPI(3), USB

Peripherals:

DMA(6), PWM(24), TEMPERATURE SENSOR, TIMER(3), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28378SPTPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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