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TMS320F28376SPTPS

Texas Instruments

TMS320F28376SPTPS by Texas Instruments

TMS320F28376SPTPS by Texas Instruments is a 32-bit microcontroller with 176 terminals, operating at up to 100 MHz. It features 20-Ch 12-Bit ADCs and connectivity options like CAN, I2C, SCI, SPI, USB. Ideal for automotive applications due to its low power mode and temperature range of -40 to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,696 parts In-Stock

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Digiode

USA . 1,234 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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One Stop Electronics

USA . 1,163 parts In-Stock

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$12.000

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Semicontronic

India . 408 parts In-Stock

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$14.000

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$13.650

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$13.580

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$14.000

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AZTECH Wire

Italy . 663 parts In-Stock

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Ampacity Inc.

Singapore . 523 parts In-Stock

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Corohmni

South Africa . 18 parts In-Stock

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Parana Technologies

USA . 779 parts In-Stock

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DigiPath Technology Company

USA . 278 parts In-Stock

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$53.028

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$48.786

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ChromeModa Solutions

Germany . 5,318 parts In-Stock

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IDEA Electronic Components Group

UK . 359 parts In-Stock

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$51.404

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Continental Prestige Electronics

USA . 6,414 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Argo Parts USA

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Corphita

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Aranea Global

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Overview

Experience the power of cutting-edge technology with the TMS320F28376SPTPS microcontroller by Texas Instruments. Designed with precision and quality in mind, this versatile device offers a wide range of applications in automotive and industrial settings. With advanced features such as multiple ADC channels, DAC channels, and PWM channels, this microcontroller provides unparalleled performance and reliability. Trust Texas Instruments for unmatched expertise and innovation in the field of microcontrollers, and see the difference it can make in your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.26 V

Allows for flexibility in power requirements and compatibility with different voltage sources.

Bit Size: 32

Offers high processing capability and data handling capacity for complex applications.

ADC Channels: YES

Enables analog to digital conversion, essential for interfacing with sensors and measuring external signals.

Maximum Clock Frequency: 100 MHz

Provides high-speed operation and efficiency for time-critical applications.

Connectivity: CAN(2), I2C(2), SCI(4), SPI(3), USB

Supports multiple communication interfaces for versatile connectivity options with other devices.

Low Power Mode: YES

Helps in conserving energy and extending battery life, making it suitable for power-sensitive applications.

Technical Specifications

Microcontrollers TMS320F28376SPTPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

97

No. of Serial I/Os:

5

No. of Terminals:

176

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

135168

RAM Words:

132

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), SPI(3), USB

Peripherals:

DMA(6), POR, TEMPERATURE SENSOR, TIMER(3), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit, 9-Ch 16-Bit

Trade Compliance

TMS320F28376SPTPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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