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TMS320F28376DZWTT

Texas Instruments

TMS320F28376DZWTT by Texas Instruments

TMS320F28376DZWTT by Texas Instruments is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 24-Ch 12-Bit ADC. It operates at up to 20 MHz, has 6 timers, and supports various peripherals like CAN, I2C, SCI, SPI, USB. Ideal for industrial applications requiring high-speed processing and multiple analog/digital conversions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,018 parts In-Stock

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7,018

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Digiode

USA . 1,922 parts In-Stock

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1,922

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Distributors (Availability)

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AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$5.713

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571

$5.713

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One Stop Electronics

USA . 1,212 parts In-Stock

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$17.000

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1,212

$17.000

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Parana Technologies

USA . 936 parts In-Stock

1+ parts

$32.295

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$103.908

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936

$32.295

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$103.908

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DigiPath Technology Company

USA . 1,334 parts In-Stock

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$35.561

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1,334

$35.561

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ChromeModa Solutions

Germany . 1,489 parts In-Stock

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$36.287

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$29.755

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1,489

$36.287

$29.755

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IDEA Electronic Components Group

UK . 1,014 parts In-Stock

1+ parts

$36.287

100+ parts

$34.473

1k+ parts

$32.658

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1,014

$36.287

$34.473

$32.658

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Corphita

USA . 4,854 parts In-Stock

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Overview

Unlock endless possibilities with the TMS320F28376DZWTT by Texas Instruments, a high-quality microcontroller that offers unparalleled performance and reliability. With a wide range of applications in various industries, this innovative product boasts advanced features such as multiple DAC and ADC channels, DMA support, and a wide range of peripherals. Experience seamless connectivity with CAN, I2C, SCI, SPI, and USB interfaces, all in a compact and durable package. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and provides exceptional value for all your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, making it suitable for various environments.

Bit Size: 32

A 32-bit architecture allows for enhanced performance and processing capabilities, making the microcontroller efficient for complex tasks.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this microcontroller can withstand harsh conditions and extended usage without overheating.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizing RISC architecture in a microcontroller design ensures efficient and streamlined performance for a wide range of applications.

Connectivity: CAN(2), I2C(2), SCI(4), SPI(3), USB

Multiple connectivity options such as CAN, I2C, SPI, and USB allow for seamless integration with various devices and systems, enhancing versatility.

Technical Specifications

Microcontrollers TMS320F28376DZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

20 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

169

No. of Serial I/Os:

4

No. of Terminals:

337

No. of Timers:

6

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

176128

RAM Words:

172

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

495 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"CAN(2), I2C(2), SCI(4), SPI(3), USB"

Peripherals:

"DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4)"

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28376DZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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