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TMS320F28375DZWTT

Texas Instruments

TMS320F28375DZWTT by Texas Instruments

TMS320F28375DZWTT by Texas Instruments is a 32-bit microcontroller with 3-Ch 12-Bit DAC and 24-Ch 12-Bit ADC. It operates at a max frequency of 100 MHz, suitable for industrial applications requiring high-speed data processing. With multiple PWM(40) and DMA(12) peripherals, it offers versatile connectivity options like CAN(2), I2C(2), SCI(4), USB.

Median Price

$24.100

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 410 parts In-Stock

1+ parts

$14.585

100+ parts

$12.965

1k+ parts

$9.533

10k+ parts

-

410

$14.585

$12.965

$9.533

-

Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$22.500

100+ parts

$15.700

1k+ parts

$14.000

10k+ parts

$13.200

30

$22.500

$15.700

$14.000

$13.200

DigiKey

USA . 532 parts In-Stock

1+ parts

$25.700

100+ parts

$18.089

1k+ parts

$16.902

10k+ parts

-

532

$25.700

$18.089

$16.902

-

Mouser Electronics

USA . 18 parts In-Stock

1+ parts

$25.700

100+ parts

$17.550

1k+ parts

$17.290

10k+ parts

-

18

$25.700

$17.550

$17.290

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,247 parts In-Stock

1+ parts

$13.856

100+ parts

-

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-

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-

2,247

$13.856

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$16.587

100+ parts

-

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-

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500

$16.587

-

-

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Vyrian

USA . 5,542 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,542

-

-

-

-

Chip Stock

USA . 3,396 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,396

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 247 parts In-Stock

1+ parts

$12.400

100+ parts

-

1k+ parts

-

10k+ parts

-

247

$12.400

-

-

-

Corphita

USA . 4,797 parts In-Stock

1+ parts

$13.126

100+ parts

-

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-

10k+ parts

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4,797

$13.126

-

-

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Continental Prestige Electronics

USA . 4,323 parts In-Stock

1+ parts

$15.205

100+ parts

-

1k+ parts

-

10k+ parts

$14.901

4,323

$15.205

-

-

$14.901

Modulus Dynamics

Lithuania . 450 parts In-Stock

1+ parts

$18.412

100+ parts

$18.228

1k+ parts

$17.676

10k+ parts

-

450

$18.412

$18.228

$17.676

-

Semicontronic

India . 200 parts In-Stock

1+ parts

$26.980

100+ parts

$26.306

1k+ parts

$26.171

10k+ parts

-

200

$26.980

$26.306

$26.171

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$35.064

100+ parts

-

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-

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432

$35.064

-

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Microchip USA

USA . 2,924 parts In-Stock

1+ parts

$46.510

100+ parts

$45.700

1k+ parts

$45.290

10k+ parts

$44.890

2,924

$46.510

$45.700

$45.290

$44.890

Parana Technologies

USA . 1,624 parts In-Stock

1+ parts

$64.032

100+ parts

$5,946.337

1k+ parts

$57.629

10k+ parts

-

1,624

$64.032

$5,946.337

$57.629

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DigiPath Technology Company

USA . 1,598 parts In-Stock

1+ parts

$70.507

100+ parts

-

1k+ parts

-

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1,598

$70.507

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ChromeModa Solutions

Germany . 5,979 parts In-Stock

1+ parts

$71.946

100+ parts

$58.996

1k+ parts

-

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5,979

$71.946

$58.996

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IDEA Electronic Components Group

UK . 357 parts In-Stock

1+ parts

$71.946

100+ parts

$68.349

1k+ parts

$64.751

10k+ parts

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357

$71.946

$68.349

$64.751

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Advanced Electronics

New Zealand . 34 parts In-Stock

1+ parts

$87.125

100+ parts

$82.768

1k+ parts

$82.768

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34

$87.125

$82.768

$82.768

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Lixinc

USA . 18,332 parts In-Stock

1+ parts

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18,332

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iodParts Technologies Inc.

India . 5,415 parts In-Stock

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5,415

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Argo Parts USA

USA . 1,434 parts In-Stock

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1,434

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$16.256

1k+ parts

$15.758

10k+ parts

$15.426

1,000

-

$16.256

$15.758

$15.426

Robosynatics

Brazil . 350 parts In-Stock

1+ parts

-

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.126

1k+ parts

$2.126

10k+ parts

$2.126

350

-

$2.126

$2.126

$2.126

Overview

Elevate your projects with the TMS320F28375DZWTT by Texas Instruments, a top-tier microcontroller that embodies excellence in performance and reliability. Crafted with precision and expertise, this device offers unparalleled quality and cutting-edge features tailored to meet your unique needs. Whether you're diving into industrial automation, power conversion, or motor control applications, this microcontroller is your ultimate companion. Experience seamless connectivity, advanced peripherals, and unmatched efficiency with the TMS320F28375DZWTT - unlocking endless possibilities for innovation and success. Upgrade to excellence today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protects the microcontroller from external elements, making it long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a moderate voltage range, ensuring stable performance and preventing potential damage from overvoltage.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the PCB and making it suitable for small form factor applications.

Bit Size: 32

32-bit architecture allows for handling larger data types and calculations, offering higher processing capabilities and improved performance.

DAC Channels: YES

Digital-to-Analog Converter channels enable the microcontroller to interface with analog devices, expanding its compatibility and functionality.

No. of Terminals: 337

A higher number of terminals allow for more connectivity options and interface possibilities, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch enhances thermal performance, signal integrity, and PCB layout density for optimal operation.

Minimum Supply Voltage: 1.14 V

Operating at a low minimum supply voltage enables energy efficiency and extends battery life in mobile and IoT devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliability in extreme temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range support allows the microcontroller to operate in harsh cold conditions without compromising performance or stability.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides excellent conductivity, durability, and solderability for reliable connections and long-term performance.

ADC Channels: YES

Analog-to-Digital Converter channels enable the microcontroller to convert analog signals into digital data, facilitating sensor interfacing and signal processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency, reduce CPU workload, and enhance overall system performance in data-intensive applications.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly by allowing for easy access to solder pads and connections, streamlining the manufacturing process.

ROM Words: 524288

Large ROM capacity accommodates extensive program storage, enabling complex algorithms, multiple applications, and firmware updates without running out of memory.

Maximum Seated Height: 1.4 mm

Low seated height profile saves space in compact designs and reduces the overall height of the PCB assembly, ideal for slim and portable devices.

Digital To Analog Convertors: 3-Ch 12-Bit

Three 12-bit Digital-to-Analog Converters provide high-resolution analog output for precision control, accurate voltage generation, and audio applications.

Width: 16 mm

Compact width dimension allows for efficient PCB layout with more components in a limited space, enhancing design flexibility and scalability.

Peripherals

An array of peripherals including DMA, PWM, temperature sensor, timers, and watchdog timers offer versatile functionality for diverse applications, simplifying system integration and enhancing user experience.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast data processing, seamless multitasking, and real-time operation, enhancing overall system performance and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time allowance at peak reflow temperature ensures proper soldering and component bonding during assembly, reducing the risk of soldering defects.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables reliable soldering in lead-free assembly processes, ensuring robust PCB connections and long-term durability.

Length: 16 mm

Standard length dimension facilitates compatibility with common PCB sizes and layouts, allowing for easy integration into existing electronic designs and systems.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh environmental conditions, making it suitable for rugged industrial applications with demanding operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture provides efficient data processing, reduced power consumption, and faster execution speed, optimizing system performance and responsiveness.

RAM Bytes: 208896

Generous RAM capacity supports data storage, manipulation, and multitasking, facilitating complex algorithms, real-time processing, and seamless operation of multiple tasks.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and reliable operation, ensuring energy efficiency and robust performance.

Terminal Form: BALL

Ball terminal form simplifies the PCB assembly process, enhances solder joint reliability, and ensures high-speed signal integrity, optimizing overall system performance and reliability.

Analog To Digital Convertors: 24-Ch 12-Bit

Twenty-four 12-bit Analog-to-Digital Converters offer precise analog signal acquisition, high-resolution sampling, and accurate sensor interfacing for a wide range of applications.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage specification ensures consistent and reliable operation of the microcontroller, preventing voltage fluctuations and ensuring reliable performance.

No. of DMA Channels: 6

Six Direct Memory Access channels provide efficient data transfer, reduce CPU overhead, and improve system responsiveness in data-intensive applications, enhancing overall performance.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog signals, motor speed, and LED brightness, offering versatile functionality for a wide range of applications.

Connectivity: CAN(2), I2C(2), SCI(4), USB

Various connectivity options including CAN bus, I2C, SCI, and USB interfaces enable seamless communication and data transfer with external devices, expanding compatibility and integration possibilities.

ROM Programmability: FLASH

Flash ROM programmability allows for flexible firmware updates, rapid prototyping, and customization of software applications, enhancing versatility and adaptability.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density PCB layout, reduces signal crosstalk, and optimizes space utilization, making it suitable for compact electronic designs and miniaturized products.

Moisture Sensitivity Level (MSL): 3

Moisture Sensitivity Level 3 indicates moderate sensitivity to moisture exposure during storage and assembly, requiring standard handling and storage precautions to prevent damage.

Speed: 200 rpm

Operates efficiently at a speed of 200 revolutions per minute, facilitating motor control, precise speed regulation, and application-specific customization for rotational devices.

On Chip Program ROM Width: 16

Wide on-chip program ROM width accommodates large program storage, allows for complex algorithms, and supports multiple applications, enhancing software development flexibility and capabilities.

No. of I/O Lines: 169

Numerous Input/Output lines provide extensive connectivity options, interface flexibility, and peripheral integration, allowing for versatile system configurations and functional expansion.

Technical Specifications

Microcontrollers TMS320F28375DZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of I/O Lines:

169

No. of Terminals:

337

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

208896

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SCI(4), USB

Peripherals:

DMA(12), POR, PWM(40), TEMPERATURE SENSOR, TIMER(6), WDT(4)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28375DZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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