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TMS320F28374SZWTTR

Texas Instruments

TMS320F28374SZWTTR by Texas Instruments

TMS320F28374SZWTTR by Texas Instruments is a 32-bit microcontroller with 24 PWM channels, 6 DMA channels, and 24 ADC channels. It operates at a max frequency of 100 MHz and has a supply current of up to 400 mA. Ideal for industrial applications requiring high-speed processing and multiple analog-to-digital conversions.

Median Price

$13.418

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Nova Conductors

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AZTECH Wire

Italy . 480 parts In-Stock

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Semicontronic

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Continental Prestige Electronics

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$13.149

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Netroflash

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Ampacity Inc.

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One Stop Electronics

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IDEA Electronic Components Group

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Microchip USA

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Advanced Electronics

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Perfect Parts

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Argo Parts USA

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Overview

Unlock the full potential of your next project with the TMS320F28374SZWTTR microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a high-quality product that offers exceptional performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with advanced features, seamless connectivity, and low power consumption. Experience the value and benefits of the TMS320F28374SZWTTR, and take your projects to the next level with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable materials ensure the longevity of the product, making it a reliable choice for long-term use.

Surface Mount: YES

Easily mountable on circuit boards, simplifying the manufacturing process and allowing for compact designs.

Maximum Supply Voltage: 1.26 V

Efficient power management ensures that the microcontroller operates within safe voltage limits, preventing damage.

On Chip Data RAM Width: 8

Wide data RAM width allows for faster data processing and storage, enhancing overall performance.

Address Bus Width: 32

Wide address bus width enables efficient memory addressing and access, enhancing the speed and capability of the microcontroller.

Package Shape: SQUARE

Square shape facilitates easy integration into circuit layouts and efficient space utilization in electronic devices.

Bit Size: 32

32-bit architecture provides higher computational power, enabling the microcontroller to handle complex tasks with ease.

DAC Channels: YES

Digital-to-Analog Converters (DAC) enable the microcontroller to interface with analog components, expanding its range of applications.

No. of Terminals: 337

A high number of terminals allow for versatile connectivity options, making the microcontroller suitable for diverse hardware configurations.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array packaging ensures secure connections and stable performance, while the low profile design conserves space and the fine pitch enhances reliability.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage enables efficient power consumption and extends battery life in portable electronic devices.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures stable performance even in harsh environmental conditions, making the microcontroller suitable for industrial applications.

CPU Family: TMS320

Belonging to a known CPU family signifies reliable performance and compatibility with existing software tools, making integration and programming easier.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the microcontroller to function in extreme cold conditions, enhancing its versatility.

Terminal Finish: TIN SILVER COPPER

The use of high-quality terminal finishing materials ensures reliable connections and prevents corrosion, increasing the product's lifespan.

ADC Channels: YES

Analog-to-Digital Converters (ADC) enable the microcontroller to convert analog signals to digital data, expanding its input options for sensor interfacing.

DMA Channels: YES

Direct Memory Access (DMA) channels enhance data transfer efficiency by allowing peripherals to access memory directly, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, ensuring easy integration into electronic designs.

ROM Words: 524288

Large ROM capacity provides ample space for program storage, allowing for complex algorithms and applications to be implemented.

Maximum Seated Height: 1.4 mm

Low seated height enables compact device designs, facilitating the creation of slim and lightweight electronic products.

Digital To Analog Convertors: 3-Ch 12-Bit

Multiple Digital-to-Analog Converters with high resolution enable precise analog output generation, crucial in applications like audio processing and control systems.

Width: 16 mm

Compact width allows for space-efficient placement on PCBs, enabling the design of smaller electronic devices.

Boundary Scan: YES

Boundary Scan feature simplifies testing and debugging during manufacturing, improving product quality and reducing time-to-market.

External Data Bus Width: 32

Wide external data bus width enhances data transfer speeds between the microcontroller and external devices, improving overall system performance.

Peripherals: DMA(6), PWM(24)

A variety of peripherals like DMA and PWM channels provide versatile interfacing options, making the microcontroller suitable for a wide range of applications.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast data processing and response times, essential for applications that require real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand peak reflow temperatures for a sufficient duration, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures stable performance under soldering conditions, preventing damage during assembly.

Length: 16 mm

Compact length enables efficient use of PCB space, allowing for denser component placement and smaller device form factors.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environments, making the microcontroller suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high performance with low power consumption, making it ideal for applications where power efficiency is crucial.

RAM Bytes: 135168

Large RAM capacity enables efficient data storage and manipulation, supporting multitasking and complex algorithms in embedded systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient operation and reliable performance.

Terminal Form: BALL

Ball terminal form simplifies the soldering process and ensures secure electrical connections, enhancing overall reliability.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple Analog-to-Digital Converters with high resolution enable precise digitization of analog signals, expanding input options for sensor interfacing.

Maximum Supply Current: 400 mA

Moderate supply current requirement ensures efficient power consumption, extending battery life in portable devices and reducing heat dissipation.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable operation, safeguarding the microcontroller from voltage fluctuations.

No. of DMA Channels: 6

Multiple DMA channels allow for efficient data transfer and processing, enhancing system performance in tasks that require high-speed data handling.

No. of Serial I/Os: 5

Multiple Serial I/O (Input/Output) channels enable communication with external devices via serial interfaces, expanding connectivity options for the microcontroller.

PWM Channels: YES

Pulse Width Modulation (PWM) channels facilitate precise control of analog devices, making the microcontroller suitable for applications like motor control and power management.

Connectivity: CAN(2), I2C(2), SPI(3), USART(4), USB

Multiple connectivity options like CAN, I2C, SPI, USART, and USB support versatile communication protocols, enabling seamless integration into various systems and networks.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, simplifying software maintenance and enhancing product longevity.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density mounting on PCBs, contributing to compact design layouts and efficient use of space.

Format: FLOATING POINT

Floating-point format allows for precise numerical calculations, essential for applications that require high accuracy in mathematical operations.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard handling procedures during manufacturing to prevent moisture-related defects.

Speed: 200 rpm

High processing speed enables rapid data manipulation and response times, essential for real-time applications where quick decision-making is crucial.

Technical Specifications

Microcontrollers TMS320F28374SZWTTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING 12-CH 16-BIT ADC

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

100 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

169

No. of Serial I/Os:

5

No. of Terminals:

337

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

135168

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(2), SPI(3), USART(4), USB

Peripherals:

DMA(6), PWM(24)

Analog To Digital Convertors:

24-Ch 12-Bit

Digital To Analog Convertors:

3-Ch 12-Bit

Trade Compliance

TMS320F28374SZWTTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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