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TMS320F28069FPZTR

Texas Instruments

TMS320F28069FPZTR by Texas Instruments

TMS320F28069FPZTR by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It features 16-Ch 12-Bit ADC channels, 6 DMA channels, and PWM(24) peripherals. Ideal for industrial applications requiring CAN, I2C, SCI(2), SPI(2), USB connectivity at a max clock frequency of 90 MHz.

Median Price

$17.946

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,750 parts In-Stock

1+ parts

$15.660

100+ parts

$13.679

1k+ parts

$9.434

10k+ parts

-

5,750

$15.660

$13.679

$9.434

-

Chip1Stop

Japan . 890 parts In-Stock

1+ parts

$17.422

100+ parts

$14.168

1k+ parts

$13.915

10k+ parts

-

890

$17.422

$14.168

$13.915

-

Arrow

USA . 885 parts In-Stock

1+ parts

$18.470

100+ parts

$14.840

1k+ parts

$14.800

10k+ parts

-

885

$18.470

$14.840

$14.800

-

Verical

USA . 885 parts In-Stock

1+ parts

$18.470

100+ parts

$14.840

1k+ parts

$14.800

10k+ parts

-

885

$18.470

$14.840

$14.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,765 parts In-Stock

1+ parts

$14.877

100+ parts

-

1k+ parts

-

10k+ parts

-

4,765

$14.877

-

-

-

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$15.073

100+ parts

-

1k+ parts

-

10k+ parts

-

70

$15.073

-

-

-

Vyrian

USA . 2,884 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,884

-

-

-

-

South Electronics

USA . 2,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 1,972 parts In-Stock

1+ parts

$13.310

100+ parts

$12.977

1k+ parts

$12.911

10k+ parts

-

1,972

$13.310

$12.977

$12.911

-

Ampacity Inc.

Singapore . 1,952 parts In-Stock

1+ parts

$13.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,952

$13.310

-

-

-

Continental Prestige Electronics

USA . 3,884 parts In-Stock

1+ parts

$13.802

100+ parts

-

1k+ parts

-

10k+ parts

$13.526

3,884

$13.802

-

-

$13.526

Corphita

USA . 4,269 parts In-Stock

1+ parts

$14.094

100+ parts

-

1k+ parts

-

10k+ parts

-

4,269

$14.094

-

-

-

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$18.570

100+ parts

-

1k+ parts

-

10k+ parts

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243

$18.570

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$32.402

100+ parts

$29.486

1k+ parts

$26.570

10k+ parts

-

1,000

$32.402

$29.486

$26.570

-

Parana Technologies

USA . 1,912 parts In-Stock

1+ parts

$48.726

100+ parts

-

1k+ parts

-

10k+ parts

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1,912

$48.726

-

-

-

Corohmni

South Africa . 220 parts In-Stock

1+ parts

$53.057

100+ parts

-

1k+ parts

-

10k+ parts

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220

$53.057

-

-

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ChromeModa Solutions

Germany . 4,800 parts In-Stock

1+ parts

$54.748

100+ parts

$44.893

1k+ parts

-

10k+ parts

-

4,800

$54.748

$44.893

-

-

IDEA Electronic Components Group

UK . 1,683 parts In-Stock

1+ parts

$54.748

100+ parts

$52.011

1k+ parts

$49.273

10k+ parts

-

1,683

$54.748

$52.011

$49.273

-

Argo Parts USA

USA . 3,298 parts In-Stock

1+ parts

-

100+ parts

-

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-

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3,298

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DigiPath Technology Company

USA . 714 parts In-Stock

1+ parts

-

100+ parts

$49.361

1k+ parts

-

10k+ parts

-

714

-

$49.361

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Netroflash

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$14.772

1k+ parts

$14.320

10k+ parts

$14.018

500

-

$14.772

$14.320

$14.018

Overview

Unlock the power of cutting-edge technology with the TMS320F28069FPZTR microcontroller from Texas Instruments. Designed to meet the highest quality standards, this versatile device offers a wide range of applications in various industries. With advanced features such as integrated peripherals, low power mode, and high-speed connectivity options, this microcontroller provides unmatched value and performance for your projects. Trust Texas Instruments for superior quality and reliability, and experience the difference with the TMS320F28069FPZTR.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and reliability for long-term use.

Surface Mount:

YES - Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage:

1.995 V - Ensures compatibility with various power sources.

Screening Level:

AEC-Q100 - Meets automotive industry standards for quality and reliability.

Package Shape:

SQUARE - Helps in efficient use of space on the circuit board.

Bit Size:

32 - Offers high computational power for complex applications.

No. of Terminals:

100 - Provides ample connectivity options for external components.

Package Style:

FLATPACK, LOW PROFILE, FINE PITCH - Enables compact design and easy integration.

Minimum Supply Voltage:

1.71 V - Allows for operation in low power conditions.

Maximum Operating Temperature:

105 °C - Ensures reliable performance in high-temperature environments.

CPU Family:

TMS320 - Known for its high-performance capabilities in embedded systems.

No. of External Interrupts:

3 - Enables quick response to external events.

Minimum Operating Temperature:

40 °C - Ideal for use in extreme cold conditions.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - Provides corrosion resistance and stable electrical connections.

ADC Channels:

YES - Allows for analog signal conversion for data processing.

DMA Channels:

YES - Enhances data transfer efficiency and performance.

Terminal Position:

QUAD - Facilitates easy soldering and connectivity on the circuit board.

ROM Words:

131072 - Offers ample storage for program and data storage.

Maximum Seated Height:

1.6 mm - Enables installation in compact devices with limited space.

Width:

14 mm - Compact size allows for versatile placement in electronic devices.

Boundary Scan:

YES - Enables testing and debugging of the device during manufacturing.

Peripherals:

BOR, DMA(6), POR, PWM(24), TEMPERATURE SENSOR, TIMER(3), WDT - Offers a wide range of features for diverse applications.

Maximum Clock Frequency:

90 MHz - Provides fast processing speeds for real-time applications.

Peak Reflow Temperature °C:

260 - Ensures reliable soldering during manufacturing.

Length:

14 mm - Compact dimensions for space-constrained applications.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial environments.

Peripheral IC Type:

MICROCONTROLLER - Designed for embedded control applications.

RAM Bytes:

102400 - Offers ample memory for efficient data storage and processing.

Technology:

CMOS - Provides low power consumption and high noise immunity.

Terminal Form:

GULL WING - Ensures secure mounting on the circuit board.

Analog To Digital Convertors:

16-Ch 12-Bit - Enables precise analog signal conversion for accurate data processing.

Maximum Supply Current:

245 mA - Ensures stable power consumption for reliable operation.

Nominal Supply Voltage:

1.8 V - Standard voltage level for compatibility with power sources.

No. of DMA Channels:

6 - Provides multiple channels for efficient data transfer.

PWM Channels:

YES - Enables precise control of digital signals for various applications.

Connectivity:

CAN, I2C, SCI(2), SPI(2), USB - Supports multiple communication protocols for versatile connectivity.

ROM Programmability:

FLASH - Allows for easy reprogramming and updating of software.

Terminal Pitch:

0.5 mm - Facilitates high-density mounting on the circuit board.

Format:

FLOATING POINT - Supports floating-point arithmetic for complex computations.

Moisture Sensitivity Level (MSL):

3 - Indicates level of protection against moisture during storage and handling.

Speed:

90 rpm - Suitable for applications that require varying processing speeds.

Low Power Mode:

YES - Helps in reducing power consumption for energy-efficient operation.

On Chip Program ROM Width:

16 - Provides sufficient storage for program code.

No. of I/O Lines:

54 - Offers ample input and output options for external communication.

Technical Specifications

Microcontrollers TMS320F28069FPZTR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

90 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), USB

Peripherals:

BOR, DMA(6), POR, PWM(24), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28069FPZTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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