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TMS320F28069FPZPQ

Texas Instruments

TMS320F28069FPZPQ by Texas Instruments

TMS320F28069FPZPQ by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It features 16-Ch 12-Bit ADC channels, 6 DMA channels, and PWM with 16 channels. Ideal for automotive applications due to its AEC-Q100 screening level and temperature grade, offering connectivity via CAN, I2C, SPI(2), UART(2), USB interfaces.

Median Price

$25.770

Lifecycle Status

Suppliers In-Stock

7

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1k+

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Texas Instruments

USA . 1,276 parts In-Stock

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$19.480

100+ parts

$17.016

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$11.735

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1,276

$19.480

$17.016

$11.735

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Mouser Electronics

USA . 573 parts In-Stock

1+ parts

$32.060

100+ parts

$22.790

1k+ parts

$22.140

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573

$32.060

$22.790

$22.140

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Digiode

USA . 1,482 parts In-Stock

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$18.506

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$18.506

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Nova Conductors

Japan . 69 parts In-Stock

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$20.510

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69

$20.510

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Bristol Electronics

USA . 50 parts In-Stock

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$22.200

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$19.536

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50

$22.200

$19.536

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Vyrian

USA . 8,286 parts In-Stock

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Electronics Depot

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Semicontronic

India . 627 parts In-Stock

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$16.560

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$16.146

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$16.063

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627

$16.560

$16.146

$16.063

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Ampacity Inc.

Singapore . 566 parts In-Stock

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$16.560

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$16.560

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Corphita

USA . 3,301 parts In-Stock

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$17.532

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Continental Prestige Electronics

USA . 5,010 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$20.510

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$20.100

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$20.510

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Parana Technologies

USA . 1,929 parts In-Stock

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$36.801

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IDEA Electronic Components Group

UK . 1,633 parts In-Stock

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$41.349

100+ parts

$39.282

1k+ parts

$37.214

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1,633

$41.349

$39.282

$37.214

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ChromeModa Solutions

Germany . 113 parts In-Stock

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$41.349

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$33.906

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113

$41.349

$33.906

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USA . 10,000 parts In-Stock

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Argo Parts USA

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DigiPath Technology Company

USA . 1,023 parts In-Stock

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$37.280

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$37.280

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Overview

Unlock the potential of your electronic designs with the TMS320F28069FPZPQ microcontroller from Texas Instruments, a leading manufacturer known for top-quality products. Ideal for automotive applications, this powerful device offers advanced features like 16-channel ADC, 6 DMA channels, and 16 PWM channels. With a maximum clock frequency of 90 MHz and low power mode for energy efficiency, this microcontroller provides unmatched performance and versatility. Trust Texas Instruments to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package material provides good protection and durability for the microcontroller.

Surface Mount: YES

Surface mount capability allows for easy mounting on a PCB, saving space and simplifying assembly.

Maximum Supply Voltage: 1.995 V

With a maximum supply voltage of 1.995 V, this microcontroller is suitable for low power applications.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the microcontroller meets automotive industry standards for reliability and quality.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit architecture provides high processing power and efficiency for complex applications.

No. of Terminals: 100

With 100 terminals, this microcontroller offers a wide range of connectivity options.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles offer flexibility for different design requirements.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage allows for operation in low power scenarios without compromising performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this microcontroller is suitable for harsh environments.

CPU Family: TMS320

TMS320 CPU family offers high performance and advanced features for demanding applications.

No. of External Interrupts: 3

3 external interrupts provide flexibility for handling external events and tasks efficiently.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can operate in extreme cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Analog to digital converter channels allow for precise measurement and control of analog signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU load.

Terminal Position: QUAD

Quad terminal position offers stability and easy soldering during PCB assembly.

ROM Words: 131072

Large ROM capacity of 131072 words allows for storing program code and data.

Maximum Seated Height: 1.2 mm

Low maximum seated height enables compact PCB design and integration in slim devices.

Width: 14 mm

Compact width of 14 mm saves space on the PCB for other components and circuitry.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the microcontroller during manufacturing and maintenance.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM(16), TEMPERATURE SENSOR, TIMER(3), WDT

Wide range of peripherals including comparators, DMA, PWM, temperature sensor, and watchdog timer enhance functionality and flexibility of the microcontroller.

Maximum Clock Frequency: 90 MHz

High maximum clock frequency of 90 MHz enables fast processing and response times for real-time applications.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C ensures reliable soldering during PCB assembly.

Length: 14 mm

Compact length of 14 mm allows for space-efficient placement on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability and performance in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller, this product offers optimized performance and features for embedded systems.

RAM Bytes: 102400

Large RAM capacity of 102400 bytes allows for storing data and variables during program execution.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and good mechanical strength for reliable connections.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel 12-bit ADCs provide precise analog signal conversion for accurate sensor readings and control.

Maximum Supply Current: 245 mA

Maximum supply current of 245 mA ensures sufficient power for operating the microcontroller and connected peripherals.

Nominal Supply Voltage: 1.8 V

Nominal supply voltage of 1.8 V ensures stable and efficient operation of the microcontroller and connected components.

No. of DMA Channels: 6

6 DMA channels enable efficient data transfer and processing, reducing CPU load and improving system performance.

PWM Channels: YES

Pulse width modulation channels allow for precise control of connected devices such as motors and LEDs.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Multiple connectivity options including CAN, I2C, SPI, UART, and USB enable communication with a wide range of devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible updating of program code and data.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller offers fine-pitch connections for compact PCB design.

Format: FLOATING POINT

Floating point format allows for accurate mathematical calculations and processing in real-time applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 90 rpm

High speed of 90 rpm enables fast data processing and response times for time-critical applications.

Low Power Mode: YES

Low power mode capability allows for reducing power consumption during idle or low activity periods.

On Chip Program ROM Width: 16

16-bit on-chip program ROM width provides sufficient capacity for storing program code and instructions.

No. of I/O Lines: 54

With 54 I/O lines, this microcontroller offers versatile connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320F28069FPZPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

90 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(16), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28069FPZPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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