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TMS320F28069FPFPQ

Texas Instruments

TMS320F28069FPFPQ by Texas Instruments

TMS320F28069FPFPQ by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 90 MHz. It features 12-channel, 12-bit analog-to-digital converters and has connectivity options such as CAN, I2C, SPI, UART, and USB. This microcontroller is commonly used in automotive applications due to its temperature grade and AEC-Q100 screening level.

Median Price

$26.720

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 842 parts In-Stock

1+ parts

$20.451

100+ parts

$17.864

1k+ parts

$12.320

10k+ parts

-

842

$20.451

$17.864

$12.320

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DigiKey

USA . 13 parts In-Stock

1+ parts

$32.990

100+ parts

$23.516

1k+ parts

$22.549

10k+ parts

-

13

$32.990

$23.516

$22.549

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,687 parts In-Stock

1+ parts

$19.428

100+ parts

-

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2,687

$19.428

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$20.402

100+ parts

-

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300

$20.402

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Vyrian

USA . 7,622 parts In-Stock

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-

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7,622

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 390 parts In-Stock

1+ parts

$17.380

100+ parts

$16.946

1k+ parts

$16.859

10k+ parts

-

390

$17.380

$16.946

$16.859

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Ampacity Inc.

Singapore . 123 parts In-Stock

1+ parts

$17.380

100+ parts

-

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-

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123

$17.380

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Corphita

USA . 2,534 parts In-Stock

1+ parts

$18.406

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-

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2,534

$18.406

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Continental Prestige Electronics

USA . 6,106 parts In-Stock

1+ parts

$18.702

100+ parts

-

1k+ parts

-

10k+ parts

$18.328

6,106

$18.702

-

-

$18.328

Aranea Global

USA . 500 parts In-Stock

1+ parts

$19.994

100+ parts

-

1k+ parts

$19.194

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500

$19.994

-

$19.194

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Corohmni

South Africa . 108 parts In-Stock

1+ parts

$37.240

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-

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108

$37.240

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Parana Technologies

USA . 206 parts In-Stock

1+ parts

$39.015

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206

$39.015

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$42.335

100+ parts

$40.218

1k+ parts

$40.218

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200

$42.335

$40.218

$40.218

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ChromeModa Solutions

Germany . 2,047 parts In-Stock

1+ parts

$43.837

100+ parts

$35.946

1k+ parts

-

10k+ parts

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2,047

$43.837

$35.946

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IDEA Electronic Components Group

UK . 426 parts In-Stock

1+ parts

$43.837

100+ parts

$41.645

1k+ parts

$39.453

10k+ parts

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426

$43.837

$41.645

$39.453

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Lixinc

USA . 12,862 parts In-Stock

1+ parts

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12,862

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Argo Parts USA

USA . 1,320 parts In-Stock

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1,320

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 740 parts In-Stock

1+ parts

-

100+ parts

$39.523

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740

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$39.523

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GreenTree Electronics

Israel . 192 parts In-Stock

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192

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Overview

Experience the power and precision of the TMS320F28069FPFPQ microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments offers unmatched quality and reliability. This microcontroller is perfect for a wide range of applications, providing exceptional performance and efficiency. With its advanced features and extensive connectivity options such as CAN, I2C, SPI, UART, and USB, this microcontroller opens up endless possibilities. Its low power mode ensures energy savings without compromising on functionality. Unlock your creativity and take your projects to new heights with the TMS320F28069FPFPQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body enhances the durability and reliability of the microcontroller, making it a great choice for long-lasting applications.

Surface Mount: YES

With surface mount capability, the microcontroller can be easily mounted on PCBs, simplifying the manufacturing process and making it suitable for space-constrained designs.

Maximum Supply Voltage: 1.995 V

The wide maximum supply voltage range allows the microcontroller to operate efficiently in various power supply conditions, making it versatile and compatible with different systems.

Screening Level: AEC-Q100

Meeting the AEC-Q100 screening level ensures that the microcontroller is designed to withstand the stringent quality and reliability requirements of automotive applications, making it a reliable choice for automotive electronic systems.

Package Shape: SQUARE

The square package shape allows for efficient use of board space, enabling compact designs and maximizing the integration of the microcontroller into the overall system.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle larger data processing and complex computations, making it ideal for applications requiring high-performance computing.

No. of Terminals: 80

The large number of terminals provides ample connectivity options, allowing the microcontroller to interface with a wide range of peripherals and sensors, enhancing its versatility in application development.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer flexibility in terms of thermal management, space optimization, and compatibility with different PCB layouts, catering to diverse design requirements.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement ensures efficient power consumption, enabling the microcontroller to operate in power-limited environments and contributing to energy-saving solutions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the microcontroller can withstand harsh operating conditions, allowing it to function reliably in demanding environments.

CPU Family: TMS320

The TMS320 CPU family boasts a strong and established reputation for high-performance and efficient processing, making the microcontroller an excellent choice for demanding computational tasks.

No. of External Interrupts: 3

The availability of multiple external interrupt inputs allows the microcontroller to respond quickly to external events, enabling it to efficiently handle real-time tasks and event-driven systems.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller's reliability and functionality even in extreme cold environments, making it suitable for various industries and climates.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finishes provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the microcontroller's long-term performance.

ADC Channels: YES

The presence of onboard analog-to-digital converter channels allows the microcontroller to directly interface with analog sensors, simplifying data acquisition and enabling versatile sensor integration.

DMA Channels: YES

Having dedicated DMA channels enhances the microcontroller's data transfer capabilities, optimizing system performance and reducing processor load, making it well-suited for high-speed data processing applications.

Terminal Position: QUAD

The quad terminal position facilitates easier soldering and assembly processes, improving manufacturability and making the microcontroller a preferred choice for high-volume production.

ROM Words: 131072

With a large ROM size of 131,072 words, the microcontroller can store extensive program instructions and data, supporting complex software applications in memory-intensive applications.

Maximum Seated Height: 1.2 mm

The low seated height allows for better space utilization and compact system designs, making the microcontroller suitable for applications with tight size constraints.

Width: 12 mm

With a narrow width of 12 mm, the microcontroller can be seamlessly integrated into compact electronic devices, ensuring efficient space utilization and enabling miniaturized product designs.

Boundary Scan: YES

The support for boundary scan functionality simplifies testing and debugging processes during manufacturing, improving production yields and reducing time-to-market for products utilizing the microcontroller.

Peripherals: BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

With a wide range of built-in peripherals, such as Brown-out Reset, Comparators, DMA channels, Pulse Width Modulation, Temperature Sensor, Timers, and Watchdog Timer, the microcontroller offers versatile functionalities, enhancing its application flexibility and reducing the need for additional external components.

Maximum Clock Frequency: 90 MHz

The high maximum clock frequency of 90 MHz allows for fast execution of instructions and efficient data processing, enabling the microcontroller to handle compute-intensive tasks and real-time operations.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capacity ensures reliable soldering during PCB assembly processes, guaranteeing the microcontroller's robustness and minimizing the risk of solder joint failures.

Length: 12 mm

The compact length of 12 mm enables the microcontroller to be easily fitted into small form factor devices, offering flexibility in product design and maximizing integration options.

Temperature Grade: AUTOMOTIVE

The microcontroller's automotive temperature grade designation signifies its capability to operate reliably within the temperature range required for automotive applications, providing enhanced durability and performance in automotive electronic systems.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller as a peripheral IC type implies that the device integrates various functional blocks, enabling standalone and comprehensive system control, making it an ideal choice for embedded systems.

RAM Bytes: 102400

The significant amount of available RAM, with a capacity of 102,400 bytes, provides ample memory for data storage and intermediate computations, ensuring efficient multitasking and data manipulation capabilities.

Technology: CMOS

Utilizing CMOS technology offers the microcontroller benefits such as low power consumption, high noise immunity, and compatibility with various logic levels, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies the microcontroller's soldering process, ensuring good solder joint quality and easy integration onto PCBs, promoting reliable and efficient manufacturing.

Analog To Digital Convertors: 12-Ch 12-Bit

The presence of twelve 12-bit analog-to-digital converters enhances the microcontroller's ability to accurately measure analog signals, making it an excellent choice for applications involving sensor interfaces and data acquisition.

Maximum Supply Current: 245 mA

With a maximum supply current rating of 245 mA, the microcontroller can deliver sufficient power to drive various peripherals and components, ensuring stable operation and enabling diverse system configurations.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V allows for efficient power consumption and compatibility with low-power designs, making the microcontroller an excellent choice for battery-operated or energy-efficient applications.

No. of DMA Channels: 6

Having six dedicated DMA channels optimizes data transfer efficiency and reduces CPU overhead, resulting in faster data processing and improved system performance.

PWM Channels: YES

The availability of Pulse Width Modulation channels enables precise control of signals with varying duty cycles, facilitating motor control, power regulation, and other applications requiring precise signal manipulation.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

With multiple connectivity options including Controller Area Network (CAN), I2C, Serial Peripheral Interface (SPI), Universal Asynchronous Receiver-Transmitter (UART), and Universal Serial Bus (USB), the microcontroller enables seamless integration with various communication protocols, expanding its compatibility and allowing for versatile system interconnectivity.

ROM Programmability: FLASH

The ROM programmability through Flash memory enables flexible and convenient firmware updates and allows for easy customization, making the microcontroller suitable for dynamic and evolving applications.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm ensures compatibility with modern PCB technology, enabling high-density mounting and reducing PCB footprint, thereby supporting miniaturized and compact electronic designs.

Format: FLOATING POINT

The inclusion of floating-point format support enables precise decimal calculations and enhances the microcontroller's suitability for applications involving mathematical operations and real-world data processing.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates the microcontroller's tolerance to moisture during storage and assembly, reducing the risk of delamination and ensuring long-term reliability in various manufacturing environments.

Speed: 90 rpm

With a speed rating of 90 revolutions per minute (rpm), the microcontroller can efficiently handle time-sensitive operations, making it suitable for controlling motor-driven systems and other applications requiring precise rotational control.

Low Power Mode: YES

The presence of a low power mode allows the microcontroller to operate in power-constrained scenarios, optimizing energy consumption and enabling longer battery life in portable or energy-efficient devices.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 bits ensures efficient and reliable storage of program instructions, enhancing code execution performance and facilitating software development for the microcontroller.

No. of I/O Lines: 40

With 40 input/output (I/O) lines, the microcontroller offers extensive connectivity options for interfacing with external devices, enabling versatile system integration and supporting complex input/output configurations.

Technical Specifications

Microcontrollers TMS320F28069FPFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

90 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28069FPFPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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