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TMS320F28068PZPS

Texas Instruments

TMS320F28068PZPS by Texas Instruments

TMS320F28068PZPS by Texas Instruments is a 32-bit microcontroller with 80 MHz clock frequency, 131072 ROM words, and 102400 RAM bytes. Ideal for automotive applications, it features ADC and DMA channels, along with 54 I/O lines for versatile connectivity.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,103 parts In-Stock

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Vyrian

USA . 3,693 parts In-Stock

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3,693

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One Stop Electronics

USA . 1,432 parts In-Stock

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$11.000

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$11.000

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AZTECH Wire

Italy . 862 parts In-Stock

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$14.613

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862

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Parana Technologies

USA . 1,722 parts In-Stock

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$74.740

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$74.740

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ChromeModa Solutions

Germany . 6,146 parts In-Stock

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$83.977

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$68.861

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6,146

$83.977

$68.861

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IDEA Electronic Components Group

UK . 1,389 parts In-Stock

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$83.977

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$79.778

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$75.579

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1,389

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$79.778

$75.579

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Component Stockers USA

USA . 248 parts In-Stock

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$99.990

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248

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QUARKTWIN TECHNOLOGY LTD

USA . 9,773 parts In-Stock

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Corphita

USA . 3,935 parts In-Stock

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$75.714

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Microchip USA

USA . 440 parts In-Stock

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Overview

Discover the power of innovation with the TMS320F28068PZPS by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers exceptional quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. From automotive to industrial automation, the TMS320F28068PZPS provides advanced performance and efficiency, making it the ideal choice for your next project. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes.

Maximum Supply Voltage: 1.995 V

Supports a wide range of supply voltages, ensuring compatibility with various power sources.

Package Shape: SQUARE

Square packages are space-efficient and easy to integrate into circuit designs.

Bit Size: 32

32-bit architecture provides higher processing capabilities compared to lower bit sizes.

Power Supplies (V): 1.8,3.3

Support for multiple power supply options allows for flexibility in system integration.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Various package styles provide options for different mounting and cooling requirements.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 125 °C

High operating temperature range makes the product suitable for challenging environmental conditions.

CPU Family: TMS320

TMS320 CPU family is known for its high performance and reliability in embedded systems.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to operate in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable electrical connections and corrosion resistance.

ADC Channels: YES

Built-in ADC channels enable analog signal processing and input capabilities.

DMA Channels: YES

DMA channels improve data transfer efficiency and performance in real-time applications.

Terminal Position: QUAD

Quad terminal position allows for easy integration into PCB layouts.

ROM Words: 131072

Large ROM size provides ample storage for program memory and firmware.

Maximum Seated Height: 1.2 mm

Low seated height enables compact and slim designs in space-constrained applications.

Width: 14 mm

Compact width allows for efficient PCB layout and space-saving designs.

Maximum Clock Frequency: 80 MHz

High clock frequency enables fast processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow soldering process with a short time duration for manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and component reliability.

Length: 14 mm

Compact length for space-saving designs and efficient PCB integration.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range and reliability for use in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Microcontroller design provides integrated peripheral functions for versatile applications.

RAM Bytes: 102400

Large RAM capacity for efficient data storage and processing in complex applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering and robust mechanical connections.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent and reliable performance.

PWM Channels: YES

Built-in PWM channels for precise control of analog signals and motor applications.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware and software.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB designs and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling precautions.

Speed: 80 rpm

Operating speed of 80 rpm for efficient data processing and response times.

No. of I/O Lines: 54

Ample I/O lines for connecting external devices and peripherals, enhancing versatility and expandability.

Technical Specifications

Microcontrollers TMS320F28068PZPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

54

No. of Terminals:

100

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F28068PZPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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