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TMS320F28067PZPS

Texas Instruments

TMS320F28067PZPS by Texas Instruments

TMS320F28067PZPS by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 102400 RAM bytes, and 16-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, CAN, I2C, SCI(2), SPI(2), UART(2), USB connectivity, and low power mode support. Operating at up to 80 MHz with PWM (16) and timer (3) peripherals for precise control in automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,964 parts In-Stock

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Vyrian

USA . 2,650 parts In-Stock

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2,650

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Distributors (Availability)

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AZTECH Wire

Italy . 874 parts In-Stock

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$10.090

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$10.090

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One Stop Electronics

USA . 252 parts In-Stock

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$34.000

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Parana Technologies

USA . 2,362 parts In-Stock

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$36.716

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DigiPath Technology Company

USA . 1,249 parts In-Stock

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$40.429

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$37.195

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1,249

$40.429

$37.195

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ChromeModa Solutions

Germany . 1,991 parts In-Stock

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$41.254

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$33.828

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1,991

$41.254

$33.828

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IDEA Electronic Components Group

UK . 121 parts In-Stock

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$41.254

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$39.191

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$37.129

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121

$41.254

$39.191

$37.129

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Component Stockers USA

USA . 467 parts In-Stock

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$219.350

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QUARKTWIN TECHNOLOGY LTD

USA . 19,921 parts In-Stock

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Authorized Procurement Solutions

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Corphita

USA . 4,561 parts In-Stock

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Overview

Unlock endless possibilities with the TMS320F28067PZPS by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality microcontrollers that cater to a wide range of applications. This powerful device offers customers unmatched value and benefits, from its advanced technology to its seamless connectivity options. Whether you're looking to enhance your automotive systems or streamline your industrial processes, this product is the perfect solution. Experience innovation like never before with the TMS320F28067PZPS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and physical protection, making the product durable and reliable.

Maximum Supply Voltage: 1.995 V

Allows for a higher voltage input, providing flexibility in various power supply configurations.

No. of Terminals: 100

Provides a large number of connection points for interfacing with other components or peripherals.

Minimum Operating Temperature: -40 °C

Can withstand very low temperatures, making it suitable for a wide range of environments.

ADC Channels: YES

Integrated Analog to Digital Converters enable precise measurement and control of analog signals.

ROM Words: 131072

Offers a large memory capacity for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER

Incorporates various peripheral features like timers, PWM, and communication interfaces for versatile applications.

Nominal Supply Voltage: 1.8 V

Operates at a standard voltage level, ensuring compatibility with typical power sources.

Connectivity: CAN, I2C, SCI(2), SPI(2), UART(2), USB

Supports multiple communication protocols, facilitating interconnection with a wide range of devices.

No. of I/O Lines: 54

Provides numerous input/output channels for interfacing with sensors, actuators, and external modules.

Technical Specifications

Microcontrollers TMS320F28067PZPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(16), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28067PZPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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