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TMS320F28066UPNT

Texas Instruments

TMS320F28066UPNT by Texas Instruments

TMS320F28066UPNT by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 69632 RAM bytes. It operates at a speed of 90 rpm, suitable for applications requiring high processing power in fields like industrial automation and motor control.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,629 parts In-Stock

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7,629

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Digiode

USA . 2,605 parts In-Stock

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2,605

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Distributors (Availability)

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AZTECH Wire

Italy . 425 parts In-Stock

1+ parts

$9.884

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425

$9.884

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One Stop Electronics

USA . 1,012 parts In-Stock

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$20.000

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$20.000

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Parana Technologies

USA . 899 parts In-Stock

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$41.979

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899

$41.979

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DigiPath Technology Company

USA . 562 parts In-Stock

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$46.224

100+ parts

$42.526

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562

$46.224

$42.526

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ChromeModa Solutions

Germany . 2,941 parts In-Stock

1+ parts

$47.167

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$38.677

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2,941

$47.167

$38.677

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IDEA Electronic Components Group

UK . 2,047 parts In-Stock

1+ parts

$47.167

100+ parts

$44.809

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$42.450

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2,047

$47.167

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$42.450

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Corphita

USA . 3,237 parts In-Stock

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Microchip USA

USA . 1,660 parts In-Stock

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Overview

Unlock the power of innovation with the TMS320F28066UPNT by Texas Instruments, a cutting-edge microcontroller designed to exceed your expectations. With Texas Instruments' reputation for excellence in technology, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller provides customers with superior performance, efficiency, and versatility. Experience the value and benefits of this product that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the microcontroller, ensuring it can withstand various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and making the overall design more compact.

Package Shape: SQUARE

The square package shape offers a standardized form factor that is easy to work with and integrates well into different design layouts.

Bit Size: 32

A 32-bit architecture provides enhanced processing power and capability, allowing for complex tasks to be efficiently executed.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages allows for flexibility in system design and implementation, catering to different power requirements.

No. of Terminals: 80

With a sufficient number of terminals, the microcontroller can interface with various external components and peripherals, enhancing its versatility.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile and compact form factor, making it suitable for applications where space is limited.

CPU Family: TMS320

The TMS320 CPU family is known for its high performance and efficiency, making it a reliable choice for demanding applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and excellent conductivity, ensuring reliable connections and signal transmission.

Terminal Position: QUAD

Quad terminal positioning allows for easy soldering and mounting onto circuit boards, simplifying the manufacturing process.

ROM Words: 131072

With a large ROM capacity of 131072 words, the microcontroller can store extensive program instructions and data, enabling complex applications to run smoothly.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds helps to prevent thermal damage and ensure reliable solder joints during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper solder reflow and component mounting, leading to robust connections and overall product reliability.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and interfaces into a single chip, simplifying system design and reducing overall component count.

RAM Bytes: 69632

With a generous RAM size of 69632 bytes, the microcontroller can efficiently store and manipulate data during operation, contributing to smooth and responsive performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection, ensuring robust connections and reliable performance in the final product.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick updates to the microcontroller firmware, allowing for flexibility in upgrading and adapting to changing requirements.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density packaging and efficient use of PCB real estate, ideal for space-constrained applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microcontroller is robust against moisture-related damage during storage and assembly processes.

Speed: 90 rpm

With a speed of 90 rpm, the microcontroller can handle tasks quickly and efficiently, making it suitable for applications requiring high performance and responsiveness.

Technical Specifications

Microcontrollers TMS320F28066UPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28066UPNT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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