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TMS320F28066UPFPS

Texas Instruments

TMS320F28066UPFPS by Texas Instruments

TMS320F28066UPFPS by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 69632 RAM bytes. It operates at a speed of 90 rpm, suitable for applications requiring high processing power in automotive and industrial control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,934 parts In-Stock

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Digiode

USA . 3,544 parts In-Stock

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3,544

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One Stop Electronics

USA . 641 parts In-Stock

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$10.000

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641

$10.000

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AZTECH Wire

Italy . 448 parts In-Stock

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$18.136

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Parana Technologies

USA . 947 parts In-Stock

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$66.362

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947

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DigiPath Technology Company

USA . 343 parts In-Stock

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$73.073

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$67.227

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343

$73.073

$67.227

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IDEA Electronic Components Group

UK . 1,442 parts In-Stock

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$74.564

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$70.836

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$67.108

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1,442

$74.564

$70.836

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ChromeModa Solutions

Germany . 574 parts In-Stock

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$74.564

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$61.142

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574

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Corphita

USA . 3,198 parts In-Stock

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Microchip USA

USA . 1,217 parts In-Stock

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Overview

Unlock the power of innovation with the Texas Instruments TMS320F28066UPFPS microcontroller. Crafted with precision and expertise by a renowned manufacturer, this cutting-edge device is designed to revolutionize your applications. With its advanced features and high-quality construction, this microcontroller offers unmatched value and benefits to customers. Whether you're in the automotive, industrial, or consumer electronics industry, the TMS320F28066UPFPS delivers exceptional performance and reliability, making it the ideal choice for your next project. Elevate your designs and stay ahead of the competition with this top-of-the-line microcontroller from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and helps protect the microcontroller from damage, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Bit Size: 32

32-bit architecture enables the microcontroller to process data and instructions more efficiently, resulting in faster performance.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages ensures compatibility with a wide range of electronic devices and systems.

No. of Terminals: 80

Having 80 terminals allows for the microcontroller to connect to various external components and peripherals, increasing its versatility.

Package Style (Meter): FLATPACK

Flatpack package style offers space-saving benefits and improved thermal performance, making it ideal for compact designs and high-temperature environments.

CPU Family: TMS320

TMS320 CPU family is known for its high performance and low power consumption, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring reliable connection and signal transmission.

ROM Words: 131072

With a ROM size of 131072 words, the microcontroller can store a large amount of program data, allowing for more complex applications to be executed.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of heat damage to the microcontroller during manufacturing, ensuring product reliability and quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for effective soldering and component bonding during assembly, ensuring secure connections and long-term reliability.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller with integrated peripherals, this product simplifies system design and reduces the need for additional components, saving space and cost.

RAM Bytes: 69632

Large RAM capacity of 69632 bytes enables the microcontroller to efficiently store and access data during operation, enhancing performance and multitasking capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering, ensuring secure connections and reliable performance in various operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and fast updates to the microcontroller's firmware, enabling flexibility and adaptability to changing requirements.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the microcontroller can be mounted on densely populated circuit boards, enabling compact and space-saving designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand standard moisture exposure levels during storage and handling, ensuring product reliability.

Speed: 90 rpm

Operating at a speed of 90 rpm, the microcontroller can deliver high-performance computing and control capabilities, meeting the requirements of demanding applications.

Technical Specifications

Microcontrollers TMS320F28066UPFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

Bit Size:

32

CPU Family:

TMS320

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

90 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320F28066UPFPS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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