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TMS320F28065PZT

Texas Instruments

TMS320F28065PZT by Texas Instruments

TMS320F28065PZT by Texas Instruments is a 32-bit microcontroller with 100 terminals, 16 PWM channels, and 102400 RAM bytes. It operates at up to 80 MHz clock frequency and supports CAN, I2C, SPI, UART connectivity. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$16.229

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,576 parts In-Stock

1+ parts

$12.418

100+ parts

$10.847

1k+ parts

$7.481

10k+ parts

-

1,576

$12.418

$10.847

$7.481

-

DigiKey

USA . 65 parts In-Stock

1+ parts

$20.040

100+ parts

$15.027

1k+ parts

-

10k+ parts

-

65

$20.040

$15.027

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,993 parts In-Stock

1+ parts

$11.797

100+ parts

-

1k+ parts

-

10k+ parts

-

4,993

$11.797

-

-

-

Vyrian

USA . 4,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,826

-

-

-

-

Chip Stock

USA . 4,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,511

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,444 parts In-Stock

1+ parts

$11.176

100+ parts

-

1k+ parts

-

10k+ parts

-

3,444

$11.176

-

-

-

Microchip USA

USA . 1,099 parts In-Stock

1+ parts

$44.440

100+ parts

$43.800

1k+ parts

$43.480

10k+ parts

$43.170

1,099

$44.440

$43.800

$43.480

$43.170

Parana Technologies

USA . 934 parts In-Stock

1+ parts

$62.047

100+ parts

-

1k+ parts

-

10k+ parts

-

934

$62.047

-

-

-

DigiPath Technology Company

USA . 1,947 parts In-Stock

1+ parts

$68.322

100+ parts

-

1k+ parts

-

10k+ parts

-

1,947

$68.322

-

-

-

ChromeModa Solutions

Germany . 2,706 parts In-Stock

1+ parts

$69.716

100+ parts

$57.167

1k+ parts

-

10k+ parts

-

2,706

$69.716

$57.167

-

-

IDEA Electronic Components Group

UK . 2,281 parts In-Stock

1+ parts

$69.716

100+ parts

$66.230

1k+ parts

$62.744

10k+ parts

-

2,281

$69.716

$66.230

$62.744

-

Overview

Unlock the power of cutting-edge technology with the TMS320F28065PZT microcontroller by Texas Instruments. Designed with precision and quality in mind, this versatile device offers unparalleled performance in a compact package. With a wide range of applications in industries such as automotive, industrial automation, and consumer electronics, this microcontroller provides value and efficiency to customers looking to elevate their projects to the next level. Experience seamless connectivity, high-speed processing, and low power consumption with the TMS320F28065PZT - the perfect choice for those seeking top-of-the-line performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

Surface Mount: YES

This allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.995 V

Provides a wide range of voltage support, allowing flexibility in power supply options.

ADC Channels: YES

Allows for analog-to-digital conversion, making the microcontroller suitable for sensor-based applications.

Maximum Clock Frequency: 80 MHz

Offers high processing speed, making the product suitable for applications that require quick data processing.

Connectivity: CAN, I2C, SCI(2), SPI(2), UART(2), USB

Provides multiple connectivity options, making it versatile and compatible with various communication protocols.

Technical Specifications

Microcontrollers TMS320F28065PZT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(16), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28065PZT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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