Loading...

TMS320F28063UPNT

Texas Instruments

TMS320F28063UPNT by Texas Instruments

TMS320F28063UPNT by Texas Instruments is a 32-bit microcontroller with 80 terminals, operating at up to 90 MHz. It features 12 ADC and PWM channels, along with connectivity options like CAN, I2C, SPI, UART, and USB. Ideal for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$7.750

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 559 parts In-Stock

1+ parts

$7.750

100+ parts

$7.600

1k+ parts

$7.440

10k+ parts

-

559

$7.750

$7.600

$7.440

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,528

-

-

-

-

Digiode

USA . 2,515 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,515

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 850 parts In-Stock

1+ parts

$9.358

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$9.358

-

-

-

One Stop Electronics

USA . 1,347 parts In-Stock

1+ parts

$33.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,347

$33.000

-

-

-

Parana Technologies

USA . 2,286 parts In-Stock

1+ parts

$62.586

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$62.586

-

-

-

DigiPath Technology Company

USA . 2,117 parts In-Stock

1+ parts

$68.915

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$68.915

-

-

-

ChromeModa Solutions

Germany . 6,397 parts In-Stock

1+ parts

$70.321

100+ parts

$57.663

1k+ parts

-

10k+ parts

-

6,397

$70.321

$57.663

-

-

IDEA Electronic Components Group

UK . 1,442 parts In-Stock

1+ parts

$70.321

100+ parts

$66.805

1k+ parts

$63.289

10k+ parts

-

1,442

$70.321

$66.805

$63.289

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,237 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,237

-

-

-

-

Corphita

USA . 3,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,927

-

-

-

-

Microchip USA

USA . 257 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

257

-

-

-

-

Overview

Unlock the power of innovation with the TMS320F28063UPNT microcontroller by Texas Instruments. Designed with precision and reliability in mind, this cutting-edge device offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller delivers exceptional value, efficiency, and flexibility. Trust Texas Instruments to provide the quality and advanced technology you need to bring your projects to life. Elevate your designs with the TMS320F28063UPNT and experience the difference that superior engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the microcontroller.

Maximum Supply Voltage: 1.995 V

With a maximum supply voltage of 1.995 V, this microcontroller is suitable for low power applications.

Bit Size: 32

The 32-bit architecture allows for efficient processing and handling of data and instructions.

Power Supplies (V): 1.8,3.3

Compatibility with multiple power supplies (1.8V and 3.3V) provides flexibility in power options for different applications.

ADC Channels: YES

The presence of Analog to Digital Convertor (ADC) channels allows for conversion of analog signals into digital data, enabling sensor interfacing.

DMA Channels: YES

Direct Memory Access (DMA) channels help in efficient data transfer between peripherals and memory, enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product integrates various peripherals and features on a single chip, making it a compact and cost-effective solution for embedded systems.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Support for multiple communication interfaces such as CAN, I2C, SPI, UART, and USB enables seamless connectivity with external devices and networks.

Technical Specifications

Microcontrollers TMS320F28063UPNT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

90 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28063UPNT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20