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TMS320F28063PFPS

Texas Instruments

TMS320F28063PFPS by Texas Instruments

TMS320F28063PFPS by Texas Instruments is a 32-bit microcontroller with 80 terminals, operating at max 80 MHz. Ideal for automotive applications, it features ADC and DMA channels, ROM of 65536 words, and PWM support. With a temp range of -40 to 125 °C, it offers high-speed performance in compact square packaging.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,394 parts In-Stock

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Digiode

USA . 1,463 parts In-Stock

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1,463

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Distributors (Availability)

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AZTECH Wire

Italy . 519 parts In-Stock

1+ parts

$11.537

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519

$11.537

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One Stop Electronics

USA . 525 parts In-Stock

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$29.000

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525

$29.000

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Parana Technologies

USA . 174 parts In-Stock

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$38.627

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174

$38.627

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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$42.533

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2,170

$42.533

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ChromeModa Solutions

Germany . 4,095 parts In-Stock

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$43.401

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$35.589

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4,095

$43.401

$35.589

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IDEA Electronic Components Group

UK . 952 parts In-Stock

1+ parts

$43.401

100+ parts

$41.231

1k+ parts

$39.061

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952

$43.401

$41.231

$39.061

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Corphita

USA . 713 parts In-Stock

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713

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Microchip USA

USA . 382 parts In-Stock

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Overview

Experience the power of innovation with the TMS320F28063PFPS microcontroller by Texas Instruments. As a leader in semiconductor manufacturing, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers unparalleled value and benefits. Unlock endless possibilities with the TMS320F28063PFPS and see your projects come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Maximum Supply Voltage: 1.995 V

Provides flexibility in power supply options and compatibility with various systems.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Bit Size: 32

32-bit architecture enables faster data processing and performance.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for versatility in different applications.

No. of Terminals: 80

Provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Offers a range of package styles for different mounting and cooling requirements.

Minimum Supply Voltage: 1.71 V

Ensures the microcontroller can operate at lower voltage levels, saving power.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for industrial and automotive applications.

CPU Family: TMS320

Belongs to a well-known and reliable CPU family, ensuring compatibility and support.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures, making it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for reliable terminal connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, expanding the microcontroller's capabilities.

DMA Channels: YES

Direct Memory Access channels enhance data transfer efficiency and offload the CPU for better performance.

Terminal Position: QUAD

Quad terminal positions facilitate easy soldering and PCB mounting.

ROM Words: 65536

Large ROM size for storing program instructions and data, accommodating complex applications.

Maximum Seated Height: 1.2 mm

Low profile design for compact and space-constrained applications.

Width: 12 mm

Compact width for efficient PCB layout and space utilization.

Maximum Clock Frequency: 80 MHz

High clock frequency for rapid data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering process, ensuring proper solder connections.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing and assembly.

Length: 12 mm

Compact length for space-saving and efficient PCB design.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range ensures reliable operation in automotive applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically as a microcontroller for embedded systems, ensuring optimized performance.

RAM Bytes: 69632

Large RAM capacity for data storage and manipulation, supporting complex algorithms and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form for reliable solder joints and PCB mounting.

Nominal Supply Voltage: 1.8 V

Optimal supply voltage for efficient performance and power consumption.

PWM Channels: YES

Integrated PWM channels for precise control of analog outputs and signal modulation.

ROM Programmability: FLASH

Flash ROM for fast and easy reprogramming of firmware and software updates.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density PCB layouts and space-saving.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance during storage and handling.

Speed: 80 rpm

Operates at a speed of 80 rpm for efficient data processing and control.

No. of I/O Lines: 40

40 I/O lines for versatile interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers TMS320F28063PFPS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

80

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

69632

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F28063PFPS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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